Antenna Systems & Technology - 2013 Spring - (Page 12)

NEW PRODUCTS & SERVICES Tunable RF Components for Smaller, Thinner Smartphones with Reliable Antenna Performance ON Semiconductor has introduced a family of Tunable RF Components (TRFC) that address the design challenges faced by engineers developing the latest generation smartphones. The new devices optimally combine tuning range, RF quality factor (Q) and frequency operation, providing a superior solution to existing fixed approaches. End-user demand for smaller, thinner handsets challenges designers to reduce antenna volume without impacting performance. At the same time, the rapid increase in demand for mobile data means that carriers worldwide are increasing the number of bands that a smartphone must cover. ON Semiconductor’s TCP30xx family of low insertion loss Passive Tunable Integrated Circuits (PTICs) and TCC-103 PTIC Controller IC allow performance to be tuned and optimized to counter lower antenna volume and increased frequency coverage requirements. They also help overcome head- and hand-effect problems. With a 4:1 tuning range and capacitance values from 1.2 picofarad (pF) to 8.2 pF, the TCP30xx PTIC series is offered in WLCSP and QFN package styles and can be used to replace traditional “fixed-match” devices. ON Semiconductor’s PTICs also allow for a more efficient use of the smartphone’s power amplifier to reduce the current drain and help extend handset battery life. A three-times improvement in data rates in marginal coverage areas can be achieved with a significant reduction in dropped or missed calls. Designed to work in conjunction with the company’s PTICs, a new PTIC Control IC is also available. The TCC-103 is a highvoltage digital-to-analog IC that provides control and bias in a tunable solution and is fully compliant with the timing needs of cellular and other wireless system requirements. The low-power IC features an integrated boost converter with three programmable outputs (up to 24 V) and an interface that allows independent control of multiple tuning elements from a single MIPI/SPI bus element. It is housed in a WLCSP package for stand-alone or module integration. The PTICs are offered in WLCSP and QFN packages and are priced at $0.50 in quantities greater than 250,000 units. High-Efficiency Addition to DC Power Portfolio Power Sources Unlimited, Inc. has announced the addition of the 48 V Flatpack S DC power system by Eltek to its power product portfolio. The Flatpack S is compact in size, highly efficient, configurable and offers improved reliability for the demanding telecom industry. The 48V Flatpack S provides 95.5 percent power conversion efficiency and is housed in a 1U standard-width telecom power shelf that is 10.3 inches (262 mm) deep and 1.6 inches (41.5 mm) 12 Antenna Systems & Technology Spring 2013 COMPONENTS / SUBSYSTEMS high. The power system is managed by the Smartpack S controller, which monitors all active components and batteries. The Smartpack S also features a wide-ranging list of battery health and monitoring algorithms to prolong the life of battery backup systems and ensure backup power when it is needed. The 1U 48VDC power system is available in 40 amp and 100 amp versions and can be configured for a variety of output power levels to meet individual application requirements. The system can be flush-mounted or mid-mounted, offers two plug-in battery breaker positions, low voltage battery disconnect (LBVD) and numerous load options. Additionally, there is a pull-out drawer for easy access to the connection points and cable strain relief. The 48 V Flatpack S is well suited for applications such as wireless base stations, LTE/4G/WIMAX, broadband, fiber-to-thecurb (FTTC), fiber-to-the-building (FTTB) and wireless remote radio head (RRH) cabinets. The 40A Systems are priced under $1,700.00 each in small quantities. Lead time for production is 10 to12 weeks ARO. Silicon Radio Platform Replacing GaAs TowerJazz has announced a fast growing Front-End Module (FEM) market, providing its Silicon Radio Platform (SRP) for smartphones and other mobile systems. TowerJazz’s SRP allows integration of the radio in mobile devices including components such as antenna switches, antenna tuners, diversity switches, controllers, low-noise-amplifiers (LNAs) and power amplifiers (PAs) eliminating the need for discrete GaAs devices. The SRP includes RF SOI technology and a SiGe PA technology together with 0.18 um RF CMOS for integration of control and MIPI (Mobile Industry Processor Interface) interface functions. TowerJazz’s latest RF SOI technology offers antenna switch and antenna tuning applications with Ron-Coff of 217fs. The technology is quickly replacing GaAs implementations and has already been adopted by multiple customers worldwide with more than 50 separate designs taped-in with initial designs ramping to production. TowerJazz’s Silicon Germanium (SiGe) PA process is built in 0.18 um technology to enable efficient integration of power amplifier, controller, and MIPI interface and also includes a throughsilicon-via to deliver performance comparable to that of GaAs at 40 percent of the cost while enabling new tunable features and affording levels of integration not otherwise possible. Several drivers are contributing to the growth in the FEM market including: connectivity everywhere – 802.11a/b/g/n/ac, NFC, GPS, Bluetooth, ZigBee, HSPA+ and LTE, the expanding www.AntennasOnline.com http://www.AntennasOnline.com

Table of Contents for the Digital Edition of Antenna Systems & Technology - 2013 Spring

Antenna Systems & Technology - 2013 Spring
Editor’s Choice
Antenna Technology Applications for Advanced LTE
Case Study: Improve Antenna Alignment Monitoring by Preventing Condensation
Antennas
Components/Subsystems
Software/System Design
Test & Measurement
Industry News
Marketplace

Antenna Systems & Technology - 2013 Spring