Evaluation Engineering - 2

CONTENTS

JULY 2019 | VOL. 58, NO. 7

INSTRUMENTATION
SPECIAL REPORT

EMI/EMC RECEIVERS
AND AMPLIFIERS

CISPR compliance, real-time
analysis driving innovation
in EMI/EMC instruments

COMPONENTS

CONTRIBUTING TECHNICAL EDITOR Rick Nelson

MEMS technology is
transforming high-density
switch matrices

SPECIAL REPORT

SEMICONDUCTOR TEST

Vendors challenged by cost
of test amid increasing
device complexity
by Mike Hockett, Editor-in-Chief

16
22
25

DEPARTMENTS
4 Editorial
4 By the Numbers
6 Industry Report

27 Tech Focus
28 Featured Tech
30 Industry Events
Preview

COMPLIANCE

Recent developments
in EMC legislation

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DESIGN FOR TEST

DIGITAL OPERATIONS MANAGER Mary Beth Romano

DFT that gets AI chips
to market faster

AUDIENCE DEVELOPMENT MANAGER Anna Hicks
ahicks@endeavorbusinessmedia.com

by Rahul Singhal

WIRELESS TEST

Q&A: Simulation's vital
role in wireless testing

by Mike Hockett, Editor-in-Chief

WEARABLE ELECTRONICS
Putting on the future

by Ken Cormier, Managing Editor

Cover photo: iStock.com/StephanHoerold

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ADVERTISING

by David Mawdsley

TECHNOLOGY INSIGHTS

EDITORIAL
EDITOR-IN-CHIEF Mike Hockett
mhockett@evaluationengineering.com
MANAGING EDITOR Ken Cormier
kcormier@evaluationengineering.com

APPLICATIONS

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by Mike Hockett, Editor-in-Chief

by Chris Giovanniello

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Evaluation Engineering

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