Evaluation Engineering - 1

CONTENTS

JUNE 2019 | VOL. 58, NO. 6

VP & GROUP PUBLISHER Alan Bergstein
abergstein@endeavorb2b.com

EDITORIAL
EDITOR-IN-CHIEF Mike Hockett
mhockett@evaluationengineering.com
MANAGING EDITOR Ken Cormier
kcormier@evaluationengineering.com

CONTRIBUTING TECHNICAL EDITOR Rick Nelson

ADVERTISING
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INSTRUMENTATION

PUBLISHER Clark Celmayster
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SPECIAL REPORT

EAST
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PRODUCTION
ART DIRECTOR Julie Whitty
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6
22

MARKETING MANAGER Nick Phillips
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The recent history
of today's high-end
oscilloscope technology

APPLICATIONS

DIGITAL OPERATIONS MANAGER Mary Beth Romano

SPECIAL REPORT

CIRCULATION

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Turnkey use, portability, and
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4 Industry Report
26 Tech Focus
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30 IMS, Sensors Expo Preview
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RF/MICROWAVE TEST

5G brings new onslaught
of challenges
by Mike Hockett, Editor-in-Chief

ATE

Protecting AI chips
from thermal challenges
during ATE test
by Carl Peach and Yi Zhang

TECHNOLOGY INSIGHTS

SENSORS

Sensors open new
vistas in electronics
by Ken Cormier, Managing Editor

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Evaluation Engineering

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