Evaluation Engineering - 20
SEMICONDUCTOR TEST
and raising the current by a factor of 10
raises the energy by a factor of 1,000.
Spreading this energy to more components-like using more parallel needles-
is sometimes possible according to the
design of the DUT. Especially on waferlevel and bare-die-level, there is no chance
to raise the number of needles by these
factors. This very often results in a compromise, which means lowering test currents to a level which could be handled.
Another challenge on wafer- and baredie-level is that the silicon itself may not
be stressed thermally since there is no
proper possibility for cooling the DUT
in that production stage.
The thermal power losses in a MOSFET
are likely the same as in any other ohmic
resistor, so the same rules may be applied
as we did before for cabling, matrix, and
so on. But there is one major difference:
The amount of thermal energy which
could be brought into the DUT is fixed
and mainly defined by the thermal
Figure 2. 1.000A
pulse with one needle.
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20
EVALUATION ENGINEERING MAY 2019
SUBMISSION
DEADLINES
July:
Abstract due 5/15,
article due 5/27
August:
Abstract due 6/14,
article due 6/27
September:
Abstract due 7/15,
article due 7/29
We at Evaluation Engineering are always looking for
as much contributed educational content as we can.
With that, here are the topics we're looking to receive
contributed articles for in our upcoming issues:
* July: Inspection, Compliance
* August: Software-Defined-Radio, Mil/Aero
* September: Medical Test, Wireless Test
These are all broad topics, but we'd let you, the contributor,
pick the specific focus. The format is also up to you. It
can be a best-practices article, a 'what's trending'-type of
piece, predictions, tips, a Q&A, or you can simply send us
commentary on a certain focus in one of those topics.
OUR GUIDELINES: The key for these articles is to be
educational/non-promotional. We'd like such an article
to range from 600 to about 2,200 words, include any
accompanying figures and imagery (hi-resolution), the
author's headshot, and up to 50 words of 'about the
author' information.
INTERESTED? Reach out to EE Editor-in-Chief Mike Hockett at
mhockett@evaluationengineering.com with an idea or abstract.
http://www.rsleads.com/905ee-906
http://www.rsleads.com/905ee-906
Evaluation Engineering
Table of Contents for the Digital Edition of Evaluation Engineering
Editorial: The Current State of 5G Wireless Service
By the Numbers
Industry Report
Modular Instruments: Amid 5G and IIoT's evolution, demand for modular instrumentation hits new heights
Cybersecurity: How vendors are shielding against the dark side
Memory: What is NVMe-oF interop testing and why is it important?
Semiconductor Test: 1000A high-current RDSon static parameter DC testing vs. pulse testing at 300µs
EE's Sights from APEC 2019
Tech Focus
Featured Tech
Industrial Internet of Things - IIoT 2019: The industrial Revolution keeps on ticking
Evaluation Engineering - Cover1
Evaluation Engineering - Cover2
Evaluation Engineering - 1
Evaluation Engineering - 2
Evaluation Engineering - 3
Evaluation Engineering - By the Numbers
Evaluation Engineering - 5
Evaluation Engineering - Industry Report
Evaluation Engineering - 7
Evaluation Engineering - Modular Instruments: Amid 5G and IIoT's evolution, demand for modular instrumentation hits new heights
Evaluation Engineering - 9
Evaluation Engineering - 10
Evaluation Engineering - 11
Evaluation Engineering - 12
Evaluation Engineering - 13
Evaluation Engineering - Cybersecurity: How vendors are shielding against the dark side
Evaluation Engineering - 15
Evaluation Engineering - Memory: What is NVMe-oF interop testing and why is it important?
Evaluation Engineering - 17
Evaluation Engineering - Semiconductor Test: 1000A high-current RDSon static parameter DC testing vs. pulse testing at 300µs
Evaluation Engineering - 19
Evaluation Engineering - 20
Evaluation Engineering - 21
Evaluation Engineering - EE's Sights from APEC 2019
Evaluation Engineering - 23
Evaluation Engineering - 24
Evaluation Engineering - 25
Evaluation Engineering - Tech Focus
Evaluation Engineering - 27
Evaluation Engineering - Featured Tech
Evaluation Engineering - 29
Evaluation Engineering - 30
Evaluation Engineering - 31
Evaluation Engineering - Industrial Internet of Things - IIoT 2019: The industrial Revolution keeps on ticking
Evaluation Engineering - Cover3
Evaluation Engineering - Cover4
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