Evaluation Engineering - 21
Figure 7: Defect classification for functional safety analysis.
Designers can also generate other
FMEDA (failure modes, effects, and diagnostic analysis) related hardware safety
metrics defined within the ISO 26262
standard. Tessent DefectSim is able produce reports suitable to support FMEDA
creation.
Conclusion
Meeting the quality and reliability requirements of ISO 26262 and other automotive
electronics standards becomes more difficult as device sizes and complexities
continue to grow. Both the digital and
analog portions of the chip must be fully
addressed. The introduction of automation
into the analysis and insertion of functional safety is allowing more comprehensive
safety solutions to be implemented and
qualified. They utilize in-system BIST solutions, such as logic BIST and nondestructive memory BIST, together with more conventional functional-safety mechanisms.
These advancements, along with the adoption of advanced test capabilities such as
automotive-grade ATPG for manufacturing test, will not only improve the ability of
semiconductor manufacturers to achieve
necessary quality and reliability metrics
but will also help to further differentiate
their products by delivering embedded
test capabilities that can be leveraged by
their customers at the system level and in
the field. In addition, the calculation and
delivery of failure metrics is also quickly
becoming a key deliverable toward meeting necessary system functional safety
goals.
Lee Harrison is Automotive IC Test Solutions
Manager with Mentor, A Siemens Business.
He has over 20 years of industry experience
with Mentor DFT products and has been
involved in the specification of new test
features and methodologies for Mentor customers, delivering high-quality DFT solutions.
With a focus on automotive, Lee is working
to ensure that current and future DFT requirements of Mentor's automotive customers are
understood and met. Lee Received his BEng
in MicroElectronic Engineering from Brunel
University London in 1996.
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Evaluation Engineering
Table of Contents for the Digital Edition of Evaluation Engineering
Editorial: Three-way race to the future
By the Numbers
Industry Report
Signal Generators: New technology demands make signal generators more integral to testing
Burn-In and Test: The importance of burn-in and test extends from semiconductors to military equipment
Automotive Test: Automation boosts analog and digital test of automotive ICs
Sensor-Based Test: The 3R's of analog position sensor-based mechanical measurements
Power Test: Recommendation of voltage line disturbance test
Featured Tech
Tech Focus
Semiconductors: Heterogeneous integration ramps up electronics clout
Evaluation Engineering - Cover1
Evaluation Engineering - Cover2
Evaluation Engineering - 1
Evaluation Engineering - By the Numbers
Evaluation Engineering - 3
Evaluation Engineering - Industry Report
Evaluation Engineering - 5
Evaluation Engineering - Signal Generators: New technology demands make signal generators more integral to testing
Evaluation Engineering - 7
Evaluation Engineering - 8
Evaluation Engineering - 9
Evaluation Engineering - 10
Evaluation Engineering - 11
Evaluation Engineering - 12
Evaluation Engineering - Burn-In and Test: The importance of burn-in and test extends from semiconductors to military equipment
Evaluation Engineering - 14
Evaluation Engineering - 15
Evaluation Engineering - Automotive Test: Automation boosts analog and digital test of automotive ICs
Evaluation Engineering - 17
Evaluation Engineering - 18
Evaluation Engineering - 19
Evaluation Engineering - 20
Evaluation Engineering - 21
Evaluation Engineering - Sensor-Based Test: The 3R's of analog position sensor-based mechanical measurements
Evaluation Engineering - 23
Evaluation Engineering - Power Test: Recommendation of voltage line disturbance test
Evaluation Engineering - 25
Evaluation Engineering - 26
Evaluation Engineering - 27
Evaluation Engineering - Featured Tech
Evaluation Engineering - 29
Evaluation Engineering - Tech Focus
Evaluation Engineering - 31
Evaluation Engineering - Semiconductors: Heterogeneous integration ramps up electronics clout
Evaluation Engineering - Cover3
Evaluation Engineering - Cover4
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