Evaluation Engineering - 30

Line-scan camera

SENSORS

SENSING PACKAGES
Nano Dimension Ltd. has announced that the
Center for Biomolecular Nanotechnologies (CBN) of
the Istituto Italiano di Tecnologia (IIT) is using Nano
Dimension's DragonFly additive-manufacturing
system to 3D-print embedded sensors in electrical
packaging.

IIT plans to use the electrical packaging for rapid
device and microsystem prototyping of next-generation micro-electro-mechanical systems (MEMS)
and wearable transducers for information and
communication technology (ICT) and biomedical
applications.
IIT researchers will utilize their expertise in MEMS
to develop reliable real-time monitoring and energy
harvesters for long battery life or battery-free
operation of devices.

Ultrasonic sensor disks
TDK Corp. has announced a
series of ceramic-based EPCOS
ultrasonic sensor disks. The series includes two standard types:
The B59050Z0206A030 has a diameter of 5.0 mm and thickness
of 1.02 mm. With a serial resonance frequency of 2,000 kHz, it features thickness oscillation mode (axial), making is suitable for use
in liquid media. The B59070Z0285D12* has a diameter of 7.0 mm
and a thickness of 0.195 mm. It offers a radial mode of oscillation
at 285 kHz and is suitable for operation exposed to air. TDK Corp.

EVALUATION ENGINEERING NOVEMBER 2019

The Chromasens truePIXA line-scan camera features twelve
spectral-selective sensors that simultaneously scan an object
within a spectral data range of 380 nm to 730 nm in twelve
individual color channels-instead of just three (RGB). The resulting
high-contrast spectral images provide precise space-resolved
spectral measurements of the whole image and in arbitrary areas
of interest. With up to 3,500 pixels per channel and 21.1-kHz line
frequency, the camera achieves optical resolution up to 60 μm/pixel
at speeds up to six meters-per-second. Because multiband imaging
encompasses a range of vision applications, no single camera
configuration can satisfy the various uses. Instead, Chromasens has
developed a camera architecture that can be customized. Seven
separate truePIXA models are available ranging from 43 dpi to 423
dpi with a variety of capabilities. Chromasens

Direct ToF module
for smartphones
ams has announced
the release of what the
company calls the world's
smallest integrated module
for direct time-of-flight
(ToF) distance measurement, providing accurate measurements
from 2 cm up to 2.5 m. The TMF8801 is more than 30% smaller than
competing ToF sensors, ams says, yet offers superior performance
in important parameters including accuracy and usability in the
presence of sunlight. Competing ToF sensors struggle to accurately
measure distance below dirty or smudged cover glass, whereas
the TMF8801 maintains high accuracy through use of its on-chip
histogram processing. ams

8.4-megapixel imager
FRAMOS, a partner of Sony
Semiconductor Solutions, has
announced the availability of
Sony's new IMX485 image
sensor for surveillance
cameras, factory-automation
applications, and industrial
environments. The IMX485
incorporates Sony's STARVIS technology to enhance visibility in low
light. It combines high sensitivity with high speed, making it suitable
for use in challenging environments such as those in which inspection
systems operate. This new 1/1.2-type CMOS sensor reaches a
resolution of 8.4 megapixels with a 2.9-µm pixel pitch. It offers a highspeed frame rate of up to 90 fps at 10-bit depth. FRAMOS

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Evaluation Engineering

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