Evaluation Engineering - 4

TE Connectivity signs
definitive agreement
to acquire Silicon
Microstructures Inc.

ANSYS to acquire
Livermore Software
Technology for $775M
ANSYS, a global provider of engineering simulation software,
announced that it has entered
into a definitive agreement to
acquire Livermore Software
Technology Corp. (LSTC), a
provider of explicit dynamics
and other advanced finiteelement analysis technology.

Measurement Specialties Inc.,
a subsidiary of TE Connectivity Ltd. (NYSE: TEL), signed a
definitive agreement on September 20 to acquire Silicon
Microstructures Inc. from

Elmos Semiconductor AG.
The agreement is subject to
customary closing conditions;
the parties expect to close the
transaction this calendar year.
The acquisition of Silicon
Microstructures will expand
TE's global reach in pressure
sensing technology, particularly in medical, transportation, and industrial applications. Upon completion, the
transaction would bring together SMI's micro-electromechanical systems (MEMS)
sensor technology design and
manufacturing capabilities,
with TE's operational scale,
customer base, and existing
sensors technologies into a
comprehensive global sensing solutions offering for
customers.
"Silicon Microstructures'
MEMS pressure sensing design and manufacturing capability is utilized in various
applications requiring miniature design and high-performance packaging,' said John
Mitchell, senior vice president and general manager of
TE's Sensor Solutions business unit. "The MEMS lowpressure sensing capability
compliments TE's pressure
offering while strategically
aligning to its market and
application focus."

4

SEMI: Total wafer shipments
to drop 6% in 2019, resume
growth in 2020

Total wafer shipments in 2019 are expected to decline 6% from
last year's historic high, with growth resuming in 2020 and
shipments reaching a new high in 2022, according to SEMI's
annual semiconductor industry silicon shipment forecast.
Forecast demand for silicon units through 2022 shows polished and epitaxial silicon shipments totaling 11,757 million
square inches in 2019, 11,977 million square inches in 2020,
12,390 million square inches in 2021, and 12,785 million square
inches in 2022.
"Silicon shipment volumes are expected to decline this
year as the industry works through accumulated inventory
and weaker demand," said Clark Tseng, director of Industry
Research and Statistics at SEMI. "The industry is expected
to stabilize in 2020 and regain growth momentum in 2021
and 2022."

EVALUATION ENGINEERING NOVEMBER 2019

Once closed, the acquisition
will empower ANSYS customers to solve a new class of engineering challenges, including
developing safer automobiles,
aircraft, and trains while reducing or even eliminating
the need for costly physical
testing.
The purchase price for the
transaction is $775 million,
of which 60% of the consideration will be paid in cash and
40% will be paid through the
issuance of ANSYS common
stock to the current owners
of LSTC. In conjunction with
the transaction, ANSYS anticipates obtaining new debt
financing to fund all or a significant portion of the cash
component of the purchase
price.
The automotive industry
has widely adopted Livermore,
CA-based LSTC's LS-DY NA-a
highly scalable multiphysics
solver-to accu rately predict
a vehicle's behav ior and the
effects on occupants during
a col li sion. To do this, LSDYNA simulates the behavior of the vehicle structure
and all components including
tires, seats, seatbelts, airbags,
Evaluation Engineering

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