Evaluation Engineeering - 27

0.65mm pitch
coaxial socket
In 2018, Smiths
Interconnect released its
new DaVinci 45G 0.65mm
pitch coaxial socket, an
extension to the DaVinci
45G portfolio, which
provides high reliability
and superior durability in
high speed testing. The socket provides a higher speed, compact
solution that supports tighter 0.65mm pitch requirements for
testing GPUs/CPUs. The proprietary design ensures long lasting
coaxial impedance accuracy because of the signal probe design
and patented IM-coated body structure to achieve high reliability
and superior durability in high-speed testing. The new DaVinci 45G
0.65mm pitch socket offers a number of benefits: high speed, at
>45 GHz/32 Gbps; >3A current carrying capacity; excellent heat
transfer property; rigorous design validation, RF measurements,
custom electrical, and mechanical simulations at Smiths
Interconnect's lab and engineering facilities. Smiths Interconnect

Extra large array socket series
In the summer of 2018, TE Connectivity introduced its extra-large
array (XLA) socket technology, which it said provides more reliable
performance with 78% better warpage control than traditional
molded socket technologies. The XLA socket technology allows TE
to design enhanced sockets to support high data speeds in nextgeneration data centers. The utilization of PCB substrates versus
other plastic materials results in minimal warpage and enables TE
to design the industry's largest one-piece socket, with sizes up to
110mm x 110mm and a 10,000+ position count capability. Because
of such large capacity, these sockets are capable of extremely fast
data rates up to 56G bps. According to TE Connectivity, XLA socket
technology also offers 33% improved true position on the solder
ball and contact, low coefficient of thermal expansion mismatch to
motherboard, and mitigates SMT risks during customer application.
Two versions are available: the hybrid land grid array/ball grid array
(LGA/BGA), and the dual compression LGA/BGA. TE Connectivity
SEPTEMBER 2019 EVALUATIONENGINEERING.COM

27


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Evaluation Engineeering

Table of Contents for the Digital Edition of Evaluation Engineeering

Editorial: EE Digs into Job Data
By the Numbers
Industry Report
Regenerative Power Supplies & Sources
Optical Communications Test
Evaluation Engineering's 2019 Job Report
DAQ/SDR
Tech Focus
Featured Tech
Big Innovations at the Nanoscale Level
Evaluation Engineeering - Cover1
Evaluation Engineeering - Cover2
Evaluation Engineeering - 1
Evaluation Engineeering - By the Numbers
Evaluation Engineeering - 3
Evaluation Engineeering - Industry Report
Evaluation Engineeering - 5
Evaluation Engineeering - Regenerative Power Supplies & Sources
Evaluation Engineeering - 7
Evaluation Engineeering - 8
Evaluation Engineeering - 9
Evaluation Engineeering - 10
Evaluation Engineeering - 11
Evaluation Engineeering - 12
Evaluation Engineeering - Optical Communications Test
Evaluation Engineeering - 14
Evaluation Engineeering - 15
Evaluation Engineeering - Evaluation Engineering's 2019 Job Report
Evaluation Engineeering - 17
Evaluation Engineeering - 18
Evaluation Engineeering - 19
Evaluation Engineeering - 20
Evaluation Engineeering - 21
Evaluation Engineeering - DAQ/SDR
Evaluation Engineeering - 23
Evaluation Engineeering - 24
Evaluation Engineeering - 25
Evaluation Engineeering - Tech Focus
Evaluation Engineeering - 27
Evaluation Engineeering - Featured Tech
Evaluation Engineeering - 29
Evaluation Engineeering - 30
Evaluation Engineeering - 31
Evaluation Engineeering - Big Innovations at the Nanoscale Level
Evaluation Engineeering - Cover3
Evaluation Engineeering - Cover4
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