Evaluation Engineering - 20

MIL/AERO TEST

Sponsored by

company recently introduced the USB104
A7-100T to bring FPGA power, efficiency,
and high-speed signal processing to the
PC/104 embedded ecosystem.

Spira
Manufacturing
shielded
air-vent
honeycomb
filters.

and chief engineer. To shield air-vent
apertures in such systems, Spira has
patented a process that can be used to
fabricate a blended honeycomb panel
(as opposed to basic brass or aluminum
honeycomb panels) that can provide up
to 40 dB of shielding above that provided
by a basic aluminum honeycomb panel,
as well as shielding that can exceed 80
dB at 1 GHz for a one-quarter-inch thick
panel. The company also offers back- and
front-mount EMI and environmental
connector-seal gaskets.

Embedded ecosystem
According to William Wadkins, FPGA
product manager at Digilent, the

PUC1
M a d e

i n

t h e

Acromag APCe7000 Series
PCI Express carrier card
for AcroPack modules.

Digilent
USB104 A7-10
0T development
board.

Wadkins explained that an onboard
USB controller provides interfacing
and programming of the FPGA through
both JTAG and UART with only a single
connection. He added that an onboard
QUAD-SPI flash stores the FPGA configuration between power cycles.
"Acromag offers a wide variety of
AcroPack I/O modules, which provide a

PCIe-based alternative to the older
IndustryPack mezzanine technology," said Robert Greenfield, business
development manager. "AcroPacks are
available for A/D, D/A, digital I/O, counter/timer, CAN bus, serial communication,
avionics interfaces, and FPGA computing
functions. Carrier cards host any mix of
up to four I/O modules on PCIe, 3U/6U
VPX, CompactPCI-Serial, and mini-ITX
form factors."
Greenfield continued, "AcroPack
I/O modules are a hybrid between the
popular but disappearing IndustryPack
modules and mini-PCIe cards that often

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EVALUATION ENGINEERING SEPTEMBER 2020

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7/24/20 7:38 AM

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Evaluation Engineering

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