EETimes - Apollo - July 20, 2009 - 35

A p o ll o El ec t r o nic s tigue properties of solder later used by [IBM installations in] Poughkeepsie, Endicott and East Fishkill for C4 [flip-chip] technology.” In addition to metallurgical science, IBM’s Apolloera developments spurred an early automated assembly approach that Munroe said “was so far advanced, it [assembly] could be done at a cost far lower, and with reliability much higher, than the AT&T proponents of integrated circuits ever thought possible.” All in all, the ULD module was a striking piece of technology in its day, foreshadowing many of the packaging trends—such as flip chip, solder bumps and surface mount— that we now take for granted. Turns out the high-end CPU in your PC and the hot graphics chip in your gaming console owe a debt of gratitude to the Apollo-era packaging engineers at IBM who got the ball rolling.p 35 EE Times | Apollo | July 20, 2009 Collector Base Emitter Figure 6: Top view of ULD NPN transistor About the Authors Ed Keyes is CTO of Semiconductor Insights, a unit of TechInsights; Vu Ho is senior process analyst at SI. Semiconductor Insights colleagues Mark Chambers, Keith Doherty, Fayez ElChamaa and Bill Farmilo contributed to this report. email: edward@semiconductor.com

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EETimes - Apollo - July 20, 2009

Table of Contents for the Digital Edition of EETimes - Apollo - July 20, 2009

Apollo - July 20, 2009
Contents
Applying the Lessons of Apollo
Why Did We Go to the Moon?
In the Trenches: Profiles of the Engineers Who Made Apollo Go
Apollo Perspectives: Video Interview with Filmmaker David Sington
Virtual Teardown: Apollo Spacesuit
Virtual Teardown: The ‘Genesis’ Rock
Apollo Chip Teardown: Unit Logic Device
Ted Sorensen on Apollo
Soviet Space Firsts
Apollo Reader Forum
EETimes - Apollo - July 20, 2009 - Apollo - July 20, 2009
EETimes - Apollo - July 20, 2009 - Contents
EETimes - Apollo - July 20, 2009 - Applying the Lessons of Apollo
EETimes - Apollo - July 20, 2009 - 4
EETimes - Apollo - July 20, 2009 - Why Did We Go to the Moon?
EETimes - Apollo - July 20, 2009 - 6
EETimes - Apollo - July 20, 2009 - 7
EETimes - Apollo - July 20, 2009 - 8
EETimes - Apollo - July 20, 2009 - In the Trenches: Profiles of the Engineers Who Made Apollo Go
EETimes - Apollo - July 20, 2009 - 10
EETimes - Apollo - July 20, 2009 - 11
EETimes - Apollo - July 20, 2009 - 12
EETimes - Apollo - July 20, 2009 - 13
EETimes - Apollo - July 20, 2009 - 14
EETimes - Apollo - July 20, 2009 - 15
EETimes - Apollo - July 20, 2009 - 16
EETimes - Apollo - July 20, 2009 - 17
EETimes - Apollo - July 20, 2009 - 18
EETimes - Apollo - July 20, 2009 - 19
EETimes - Apollo - July 20, 2009 - 20
EETimes - Apollo - July 20, 2009 - 21
EETimes - Apollo - July 20, 2009 - 22
EETimes - Apollo - July 20, 2009 - Apollo Perspectives: Video Interview with Filmmaker David Sington
EETimes - Apollo - July 20, 2009 - 24
EETimes - Apollo - July 20, 2009 - Virtual Teardown: Apollo Spacesuit
EETimes - Apollo - July 20, 2009 - 26
EETimes - Apollo - July 20, 2009 - 27
EETimes - Apollo - July 20, 2009 - 28
EETimes - Apollo - July 20, 2009 - Virtual Teardown: The ‘Genesis’ Rock
EETimes - Apollo - July 20, 2009 - 30
EETimes - Apollo - July 20, 2009 - 31
EETimes - Apollo - July 20, 2009 - Apollo Chip Teardown: Unit Logic Device
EETimes - Apollo - July 20, 2009 - 33
EETimes - Apollo - July 20, 2009 - 34
EETimes - Apollo - July 20, 2009 - 35
EETimes - Apollo - July 20, 2009 - Ted Sorensen on Apollo
EETimes - Apollo - July 20, 2009 - 37
EETimes - Apollo - July 20, 2009 - 38
EETimes - Apollo - July 20, 2009 - Soviet Space Firsts
EETimes - Apollo - July 20, 2009 - 40
EETimes - Apollo - July 20, 2009 - 41
EETimes - Apollo - July 20, 2009 - Apollo Reader Forum
EETimes - Apollo - July 20, 2009 - 43
EETimes - Apollo - July 20, 2009 - 44
EETimes - Apollo - July 20, 2009 - 45
EETimes - Apollo - July 20, 2009 - 46
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