IEEE Awards Booklet - 2020 - 20

2020 IEEE TECHNICAL FIELD AWARDS

IEEE Electronics Packaging Technology Award
Sponsored by the IEEE Electronics Packaging Society

Mitsumasa Koyanagi and Peter Ramm

For pioneering contributions leading to the commercialization of 3D wafer and die
level stacking packaging

Mitsumasa Koyanagi's and Peter Ramm's efforts in developing, demonstrating, and commercializing 3D integrated circuit
(3DIC) integration processes have played a key role in enabling
ever-smaller yet more-powerful devices especially important to
mobile communications. 3D integration and packaging involves
stacking silicon wafers and interconnecting them vertically so that
they behave as a single device, which achieves performance at
reduced power and with a smaller footprint than conventional
2D processes. Koyanagi succeeded in fabricating 3D stacked image sensor, 3D stacked memory, and 3D stacked microprocessor
test chips using through-silicon vias (TSVs) for the first time. He
also demonstrated a four-layer stacked image sensor with quarter video graphics array resolution, a four-layer stacked multicore
processor, and a four-layer stacked heterogeneous image sensor
with extremely high frame rate. Ramm developed and patented

3D integration approaches with particular focus on die-to-wafer
stacking, using low-temperature bonding and vertical integration
of IC devices with TSVs, and demonstrated a complete industrial 3DIC integration process. He also published results on key
processes such as 3D metallization including robust IMC interconnections and on advanced sensor applications of 3D heterogeneous integration.
An IEEE Life Fellow, Koyanagi is a Senior Research Fellow at
Tohoku University, Sendai, Miyagi, Japan.
An IEEE Senior Member, Ramm is the head of Strategic Projects at Fraunhofer EMFT, Munich, Bavaria, Germany.

IEEE Electromagnetics Award

IEEE James L. Flanagan Speech and Audio
Processing Award

Sponsored by the IEEE Antennas and Propagation Society, IEEE Electromagnetic
Compatibility Society, IEEE Geoscience and Remote Sensing Society, and IEEE
Microwave Theory and Techniques Society

Sponsored by the IEEE Signal Processing Society

Tapan Kumar Sarkar

Hynek Hermansky

For contributions to the efficient and
accurate solution of computational
electromagnetic problems in frequency
and time domain, and for research in
adaptive antennas

For contributions to speech processing
and feature extraction for robust speech
recognition

Known for his ability to reduce complicated theory and apply it to
real-world challenges, Tapan Kumar Sarkar is bridging the gap between electromagnetics and communication systems to modernize
applications ranging from wave propagation to smart antennas using
real-time adaptive systems. He developed novel techniques for the
solution of extremely large problems on parallel out-of-core solvers
having millions of unknowns with reduced computational resources,
a breakthrough in scientific computations.This helped the design of
antennas for early warning radar systems and ultrawideband antenna
systems, electrical characterization of printed circuits, and design of
complex microwave systems with less interference. He has also applied electromagnetic technology to improve detection of improvised explosive devices in war zones and to improve food processing.
An IEEE Life Fellow, Sarkar is a professor with the College
of Engineering and Computer Science at Syracuse University,
Syracuse, NY, USA.

The pioneering speech processing methods developed by Hynek
Hermansky are some of the most widely used in speech recognition, speech and audio coding, and speaker and language recognition. Known for innovative signal processing approaches
that make speech parameters insensitive to channel variability
and noise, his many accomplishments include Perceptual Linear
Prediction (PLP) signal representation, Relative Spectral Analysis
(RASTA) processing, and TRAP and TANDEM neural net based
feature extraction technique. 
An IEEE Fellow, Hermansky is the Julian S. Smith Professor of
Electrical Engineering and director of the Center for Language
and Speech Processing at Johns Hopkins University, Baltimore,
MD, USA.

20 | 2020 IEEE AWARDS BOOKLET
IEEE Awards Booklet - 2020

Table of Contents for the Digital Edition of IEEE Awards Booklet - 2020
