IEEE Awards Booklet - 2022 - 23

2022 IEEE TECHNICAL FIELD AWARDS
IEEE Fourier Award for Signal Processing
Sponsored by Mitsubishi Electric Research Labs (MERL)
Ali H. Sayed
IEEE Rao R. Tummala Electronics Packaging Award
Sponsored by the IEEE Electronics Packaging Society
and Friends of Rao R. Tummala
Douglas C.H. Yu
For contributions to the theory and
practice of adaptive signal processing
A world leader in adaptive signal processing, the algorithms and
methodologies developed by Ali H. Sayed have taken adaptive
system design to a new level. These systems feature self-learning
abilities that continually adjust their structure in response to
interactions with the environment. They are used across many
fields including communication systems, guidance and control,
biomedical instrumentation, and robotics. He was among the
early proponents of adaptive mitigation techniques applicable
to circuit imperfections; wireless location technologies; and enhanced
multiuser, multiantenna receivers. He pioneered the concepts
of diffusion learning and regularized robust filtering, which
are driving innovation in multiagent system design such as robotic
swarms and networked intelligent systems and monitoring
of smart grids.
An IEEE Fellow, Sayed is dean of engineering at the Ecole Polytechnique
Federale de Lausanne (EPFL), Lausanne, Switzerland.
For contributions to the development of
advanced packaging technologies and
their implementation in high-volume
manufacturing
Douglas C.H. Yu's advanced packaging technologies paved the way
for technology standards and semiconductor trends that supported
continued scaling of microelectronics, enhancing high-performance
computing, wireless, and artifi cial intelligence applications.
At Taiwan Semiconductor Manufacturing Corporation Yu led the
introduction of the copper/low-k dielectric interconnects, a signifi
cant improvement in on-chip wiring performance. He led the
development of the innovative TSMC 3DFabric system integration
technology platformthat includes chip-on-wafer-on-substrate
(CoWoS), integrated fan-out (InFO) wafer-level-package, and system-on-integrated
chip (SoIC) technologies. This holistic solution
for advanced packaging is critical to continued improvement in
performance, power, and form factor of heterogeneous integrated
microelectronic systems for wide applications.
An IEEE Fellow, Yu is vice president of Taiwan Semiconductor
Manufacturing Company, Hsinchu, Taiwan.
IEEE James L. Flanagan Speech and Audio Processing Award
Sponsored by Mitsubishi Electric Research Labs (MERL)
Nelson Morgan and Hervé Bourlard
For contributions to neural networks for statistical speech recognition
The long-term (since 1988) collaborative efforts of Nelson Morgan
and Hervé Bourlard in developing neural network technology
(NN) for speech processing laid the foundation for the revolution
in speech recognition that has led to the modern dominant approaches
that, among many applications, make speech-to-text and
speech interactions with smart devices possible. Long before NNs
became globally fashionable, they laid down key links between NN,
Bayesian statistics, and linear algebra and set out the key architectural
ideas of integrating the sequential pattern matching power of
a Hidden Markov Model (HMM) with the phonetic discrimination
of a NN for automatic speech recognition (ASR). While their
methods were originally considered very computationally expensive,
the duo continued improving the use of NNs in ASR until advances
in computational power allowed a breakthrough using their
original HMM/NN architecture. They also led the development of
techniques for transcribing in speaker-independent, multispeaker
environments, as well as for recognizing speech in noise.
An IEEE Fellow, Morgan is a researcher (retired) with the International
Computer Science Institute, Phoenix, AZ, USA and
Professor in Residence Emeritus at the University of California,
Berkeley, CA, USA.
An IEEE Fellow, Bourlard is director of the Idiap Research
Institute, Martigny, and full professor at the École Polytechnique
Fédérale de Lausanne, Switzerland.
23 | 2022 IEEE AWARDS BOOKLET
IEEE Awards Booklet - 2022

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