IEEE Awards Booklet - 2023 - 9

2023 IEEE SPECTRUM'S CORPORATE AWARDS
IEEE Spectrum Emerging Technology Award
Sponsored by IEEE Spectrum
IEEE Spectrum Technology in the Service of Society
Award
Sponsored by IEEE Spectrum
IntelĀ®
Data Center GPU Max Series (formerly Ponte Vecchio).
As high-end supercomputing enters the exaflops era, advanced
semiconductor technologies are being pushed to their limits
to sustain the regular performance gains that have been fueled
during the Moore's Law era.
The Max Series GPU is Intel's highest-density processor
ever, packing over 100 billion transistors into a package and
incorporating up to 128 gigabytes of high-bandwidth memory.
A great example of Intel's IDM 2.0 strategy come to life, the
GPU comprised of a total of 47 tiles brought together by Intel's
advanced packaging technology, EMIB, that enables a low-power,
high-speed connection between the tiles, these are put together
in Foveros 3D packaging that creates the vertical stacking of
logic on Logic for memory, power and interconnects density all
connected by high bandwidth interfaces like FDI and MDFI that
allows the scaling in both 3D and 2D. To pull off this semiconductor
marvel, Intel engineers had to push the limits with die 2 die
IO, clock circuits, thermal regulation, test, and power delivery. The
Max Series GPU supports the Aurora supercomputer. Built with
more than ten thousand computing nodes, each one consisting of
two Intel Xeon CPU Max Series and six Intel Data Center GPU
Max series. At full speed, the computer is expected to achieve a
peak processing rate of 2 quintillion floating-point operations per
second (2 exaflops, or 2 x 1018
flops).
One of the reasons for the COVID pandemic's persistence and
severity has been the virus' rapid rate of evolution. Waves of new
variants spread in the population faster than new vaccines could
be designed, produced, and distributed. From the very beginning,
the ability to track and analyze the virus's evolution and to predict
its future course has been paramount-a fact underscored recently
by the rapid rise in some areas of the XBB.1.5 ( " kraken " ) and
BQ.1.1 variants, in late 2022, and no doubt new variants to come.
For public health officials and others seeking to limit the
spread of the disease, antigenic cartography software has become
an essential tool. This widely used method is based on the work
done by Derek Smith and Ron Fouchier roughly 20 years ago.
Their pioneering work was aimed at understanding the evolution
of the influenza viruses, and software based on that work has
been used since then by agencies including the World Health
Organization to plan vaccines for the upcoming flu seasons. In
recent years, Smith and colleagues at the University of Cambridge
and elsewhere have updated their models to include data on the
immune responses of sera containing antibodies to a variety of
diseases, such as different strains of COVID. The maps generated
by these updated models are being used by the U.S. National
Institutes of Health, the World Health Organization, and multiple
other organizations to monitor the evolution of the COVID
virus and to plan for future vaccines.
For more on this software, see https://spectrum.ieee.org/
omicron-covid-variant
9 | 2023 IEEE AWARDS BOOKLET
https://spectrum.ieee.org/omicron-covid-variant https://spectrum.ieee.org/omicron-covid-variant

IEEE Awards Booklet - 2023

Table of Contents for the Digital Edition of IEEE Awards Booklet - 2023

Table of Contents
IEEE Awards Booklet - 2023 - Cover1
IEEE Awards Booklet - 2023 - Cover2
IEEE Awards Booklet - 2023 - 1
IEEE Awards Booklet - 2023 - 2
IEEE Awards Booklet - 2023 - 3
IEEE Awards Booklet - 2023 - 4
IEEE Awards Booklet - 2023 - 5
IEEE Awards Booklet - 2023 - 6
IEEE Awards Booklet - 2023 - 7
IEEE Awards Booklet - 2023 - Table of Contents
IEEE Awards Booklet - 2023 - 9
IEEE Awards Booklet - 2023 - 10
IEEE Awards Booklet - 2023 - 11
IEEE Awards Booklet - 2023 - 12
IEEE Awards Booklet - 2023 - 13
IEEE Awards Booklet - 2023 - 14
IEEE Awards Booklet - 2023 - 15
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IEEE Awards Booklet - 2023 - 21
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IEEE Awards Booklet - 2023 - 29
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IEEE Awards Booklet - 2023 - 33
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IEEE Awards Booklet - 2023 - 35
IEEE Awards Booklet - 2023 - 36
IEEE Awards Booklet - 2023 - 37
IEEE Awards Booklet - 2023 - 38
IEEE Awards Booklet - 2023 - 39
IEEE Awards Booklet - 2023 - 40
IEEE Awards Booklet - 2023 - Cover3
IEEE Awards Booklet - 2023 - Cover4
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