IEEE Circuits and Systems Magazine - Q3 2021 - 61

n-Type zT
1.4
1.2
1
0.8
0.6
0.4
0.2
Bi2Te3
PbTe
CoSb3
0.8
0.6
0.4
0.2
200 400 600
Temperature (°C)
(a)
800 1,000
PbTe
SiGe
1.4
1.2
1
p-Type zT
TAGS
Sb2Te3
CeFe4Sb12
SiGe
Yb14MnSb11
200 400 600
Temperature (°C)
(b)
Figure 7. Figure-of-merit zT of state-of-the-art commercial materials [13].
solid-state semiconductor technologies that are compatible
with the technology of fabrication of microelectromechanical
systems (MEMS), electrochemical methods,
MBE, CVD. The working areas of TEGs are formed
as submicron film layers. The main advantage of TEGs
based on the MEMS technology are their high specific
power (power per unit area), which is 3-5 times higher
than that of bulk TEGs. With a temperature difference of
tens of degrees, TEGs on MEMS-based technology provide
an output power of several μW at an output voltage
of several volts. At the physical level, a TEG is a series
connection of n- and p-type thermoelements located
between two nonconductive plates (hot and cold sides).
Thermocouples are connected by means of metal pads.
Semiconductor thermoelectric materials providing the
highest conversion ratio of heat into electricity are used
in TEG fabrication. The maximum efficiency of thermoelectric
material is determined by a dimensionless parameter
expressed by (1). The maximum values of ZT for
semiconductor materials lie in the range of 0.8-1.1, and
the higher values are reached for p-type semiconductors
(see Fig. 7).
The development and simulation are carried out by
applying ANSYS Workbench based on the finite elements
method. The simulation process consists of the following
stages: Preprocessing, Solving and Postprocessing
(see Fig. 8). The above-mentioned simulation technique
was thoroughly described in [14]-[19].
The Preprocessing stage includes 5 steps:
■ the use of ANSYS Design Modeler to build/edit the
model geometry and assign attributes to it for 3Dmodel
design;
■ the choose of the analysis type, which is Thermalelectric
to model a TEG;
THIRD QUARTER 2021
800 1,000
Preprocessing
* Geometry
- 3D-Geometry Model Design
* Choice of Analysis
- Thermal-Electric
* Set the Engineering Data
- Electrical Resistivity
- Thermal Conductivity
- Seebeck Coefficient
- Parasitic Interfaces
* Design of the Solid State Model
* FEM Mesh Generation
Solving
* Choice of Analysis
- Steady-State
* Set Boundary Conditions
* Set Analysis Parameters
- Electrical and Thermal
Postprocessing
* Display Results as:
- Contour Plot (Temperature, Potentials)
- Vector Plot (Flux Densities)
* Export:
- Voltage
- Electric Current
- Electric Power
Figure 8. Simulation process flow-chat.
IEEE CIRCUITS AND SYSTEMS MAGAZINE
61
zT
zT

IEEE Circuits and Systems Magazine - Q3 2021

Table of Contents for the Digital Edition of IEEE Circuits and Systems Magazine - Q3 2021

Contents
IEEE Circuits and Systems Magazine - Q3 2021 - Cover1
IEEE Circuits and Systems Magazine - Q3 2021 - Cover2
IEEE Circuits and Systems Magazine - Q3 2021 - Contents
IEEE Circuits and Systems Magazine - Q3 2021 - 2
IEEE Circuits and Systems Magazine - Q3 2021 - 3
IEEE Circuits and Systems Magazine - Q3 2021 - 4
IEEE Circuits and Systems Magazine - Q3 2021 - 5
IEEE Circuits and Systems Magazine - Q3 2021 - 6
IEEE Circuits and Systems Magazine - Q3 2021 - 7
IEEE Circuits and Systems Magazine - Q3 2021 - 8
IEEE Circuits and Systems Magazine - Q3 2021 - 9
IEEE Circuits and Systems Magazine - Q3 2021 - 10
IEEE Circuits and Systems Magazine - Q3 2021 - 11
IEEE Circuits and Systems Magazine - Q3 2021 - 12
IEEE Circuits and Systems Magazine - Q3 2021 - 13
IEEE Circuits and Systems Magazine - Q3 2021 - 14
IEEE Circuits and Systems Magazine - Q3 2021 - 15
IEEE Circuits and Systems Magazine - Q3 2021 - 16
IEEE Circuits and Systems Magazine - Q3 2021 - 17
IEEE Circuits and Systems Magazine - Q3 2021 - 18
IEEE Circuits and Systems Magazine - Q3 2021 - 19
IEEE Circuits and Systems Magazine - Q3 2021 - 20
IEEE Circuits and Systems Magazine - Q3 2021 - 21
IEEE Circuits and Systems Magazine - Q3 2021 - 22
IEEE Circuits and Systems Magazine - Q3 2021 - 23
IEEE Circuits and Systems Magazine - Q3 2021 - 24
IEEE Circuits and Systems Magazine - Q3 2021 - 25
IEEE Circuits and Systems Magazine - Q3 2021 - 26
IEEE Circuits and Systems Magazine - Q3 2021 - 27
IEEE Circuits and Systems Magazine - Q3 2021 - 28
IEEE Circuits and Systems Magazine - Q3 2021 - 29
IEEE Circuits and Systems Magazine - Q3 2021 - 30
IEEE Circuits and Systems Magazine - Q3 2021 - 31
IEEE Circuits and Systems Magazine - Q3 2021 - 32
IEEE Circuits and Systems Magazine - Q3 2021 - 33
IEEE Circuits and Systems Magazine - Q3 2021 - 34
IEEE Circuits and Systems Magazine - Q3 2021 - 35
IEEE Circuits and Systems Magazine - Q3 2021 - 36
IEEE Circuits and Systems Magazine - Q3 2021 - 37
IEEE Circuits and Systems Magazine - Q3 2021 - 38
IEEE Circuits and Systems Magazine - Q3 2021 - 39
IEEE Circuits and Systems Magazine - Q3 2021 - 40
IEEE Circuits and Systems Magazine - Q3 2021 - 41
IEEE Circuits and Systems Magazine - Q3 2021 - 42
IEEE Circuits and Systems Magazine - Q3 2021 - 43
IEEE Circuits and Systems Magazine - Q3 2021 - 44
IEEE Circuits and Systems Magazine - Q3 2021 - 45
IEEE Circuits and Systems Magazine - Q3 2021 - 46
IEEE Circuits and Systems Magazine - Q3 2021 - 47
IEEE Circuits and Systems Magazine - Q3 2021 - 48
IEEE Circuits and Systems Magazine - Q3 2021 - 49
IEEE Circuits and Systems Magazine - Q3 2021 - 50
IEEE Circuits and Systems Magazine - Q3 2021 - 51
IEEE Circuits and Systems Magazine - Q3 2021 - 52
IEEE Circuits and Systems Magazine - Q3 2021 - 53
IEEE Circuits and Systems Magazine - Q3 2021 - 54
IEEE Circuits and Systems Magazine - Q3 2021 - 55
IEEE Circuits and Systems Magazine - Q3 2021 - 56
IEEE Circuits and Systems Magazine - Q3 2021 - 57
IEEE Circuits and Systems Magazine - Q3 2021 - 58
IEEE Circuits and Systems Magazine - Q3 2021 - 59
IEEE Circuits and Systems Magazine - Q3 2021 - 60
IEEE Circuits and Systems Magazine - Q3 2021 - 61
IEEE Circuits and Systems Magazine - Q3 2021 - 62
IEEE Circuits and Systems Magazine - Q3 2021 - 63
IEEE Circuits and Systems Magazine - Q3 2021 - 64
IEEE Circuits and Systems Magazine - Q3 2021 - 65
IEEE Circuits and Systems Magazine - Q3 2021 - 66
IEEE Circuits and Systems Magazine - Q3 2021 - 67
IEEE Circuits and Systems Magazine - Q3 2021 - 68
IEEE Circuits and Systems Magazine - Q3 2021 - 69
IEEE Circuits and Systems Magazine - Q3 2021 - 70
IEEE Circuits and Systems Magazine - Q3 2021 - 71
IEEE Circuits and Systems Magazine - Q3 2021 - 72
IEEE Circuits and Systems Magazine - Q3 2021 - 73
IEEE Circuits and Systems Magazine - Q3 2021 - 74
IEEE Circuits and Systems Magazine - Q3 2021 - 75
IEEE Circuits and Systems Magazine - Q3 2021 - 76
IEEE Circuits and Systems Magazine - Q3 2021 - 77
IEEE Circuits and Systems Magazine - Q3 2021 - 78
IEEE Circuits and Systems Magazine - Q3 2021 - 79
IEEE Circuits and Systems Magazine - Q3 2021 - 80
IEEE Circuits and Systems Magazine - Q3 2021 - 81
IEEE Circuits and Systems Magazine - Q3 2021 - 82
IEEE Circuits and Systems Magazine - Q3 2021 - 83
IEEE Circuits and Systems Magazine - Q3 2021 - 84
IEEE Circuits and Systems Magazine - Q3 2021 - 85
IEEE Circuits and Systems Magazine - Q3 2021 - 86
IEEE Circuits and Systems Magazine - Q3 2021 - 87
IEEE Circuits and Systems Magazine - Q3 2021 - 88
IEEE Circuits and Systems Magazine - Q3 2021 - 89
IEEE Circuits and Systems Magazine - Q3 2021 - 90
IEEE Circuits and Systems Magazine - Q3 2021 - 91
IEEE Circuits and Systems Magazine - Q3 2021 - 92
IEEE Circuits and Systems Magazine - Q3 2021 - 93
IEEE Circuits and Systems Magazine - Q3 2021 - 94
IEEE Circuits and Systems Magazine - Q3 2021 - 95
IEEE Circuits and Systems Magazine - Q3 2021 - 96
IEEE Circuits and Systems Magazine - Q3 2021 - Cover3
IEEE Circuits and Systems Magazine - Q3 2021 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2023Q3
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2023Q2
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2023Q1
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2022Q4
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2022Q3
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2022Q2
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2022Q1
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2021Q4
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2021q3
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2021q2
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2021q1
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2020q4
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2020q3
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2020q2
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2020q1
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2019q4
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2019q3
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2019q2
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2019q1
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2018q4
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2018q3
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2018q2
https://www.nxtbook.com/nxtbooks/ieee/circuitsandsystems_2018q1
https://www.nxtbookmedia.com