IEEE Circuits and Systems Magazine - Q1 2023 - 36

Feature
Modeling and Simulation
Challenges and Solutions
in Cooling Systems for
Nanoscale Integrated
Circuits
Federico Terraneo, Member, IEEE, Alberto Leva, Member, IEEE,
William Fornaciari, Senior Member, IEEE, and David Atienza, Fellow, IEEE
Digital Object Identifier 10.1109/MCAS.2023.3234727
Date of current version: 12 April 2023
36
IEEE CIRCUITS AND SYSTEMS MAGAZINE
1531-636X/23©2023IEEE
FIRST QUARTER 2023
IMAGE LICENSED BY INGRAM PUBLISHING

IEEE Circuits and Systems Magazine - Q1 2023

Table of Contents for the Digital Edition of IEEE Circuits and Systems Magazine - Q1 2023

Contents
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IEEE Circuits and Systems Magazine - Q1 2023 - Cover3
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