IEEE Circuits and Systems Magazine - Q1 2023 - 56

David Atienza (Fellow, IEEE) received
the Ph.D. degree in computer science
and engineering from the Universidad
Complutense de Madrid (UCM), Spain,
and IMEC, Belgium, in 2005. He is a
Full Professor of electrical and computer
engineering and the Head of the Embedded Systems
Laboratory (ESL) at the Swiss Federal Institute of
Technology Lausanne (EPFL), Switzerland. His research
interests include system-level design methodologies for
high-performance multi-processor system-on-chip (MPSoC)
and low power Internet-of-Things (IoT) systems,
including new 2-D/3-D thermal-aware design for MPSoCs
and many-core servers, and edge AI architectures
for wireless body sensor nodes and smart consumer devices.
He is a coauthor of more than 350 papers in peerreviewed
international journals and conferences, one
book, and 12 patents in these fields. He received the ICCAD
2020 10-Year Retrospective Most Influential Paper
Award, the DAC Under40 Innovators Award in 2018, the
IEEE TCCPS Mid-Career Award in 2018, an ERC Consolidator
Grant in 2016, the IEEE CEDA Early Career Award
in 2013, the ACM SIGDA Outstanding New Faculty Award
in 2012, and a Faculty Award from Sun Labs at Oracle in
2011. He served as the DATE 2015 Program Chair and
DATE 2017 General Chair. He is an IEEE Fellow and an
ACM Fellow. He served as the IEEE CEDA President from
2018 to 2019 and the Chair for EDAA from 2022 to 2023.
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56
IEEE CIRCUITS AND SYSTEMS MAGAZINE
FIRST QUARTER 2023
https://www.modelica.org/ https://www.fmi-standard.org/ https://www.nist.gov/system/files/documents/srd/REFPROP8.PDF https://www.cug.org/proceedings/cug2013_proceedings/includes/files/pap130.pdf https://www.cug.org/proceedings/cug2013_proceedings/includes/files/pap130.pdf
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