IEEE Consumer Electronics Magazine - March/April 2021 - 52

The Art of Storage

Figure 1. Ambiq Apollo4 Chip Block Diagram (Image used with permission from Ambiq).

SRAM. The BLE Radio blocks are in the Bluetooth version of the chip.
Ambiq says that the Apollo4 can serve as
both an application processor and coprocessor
for battery-powered endpoint devices, including
smartwatches, fitness bands, animal trackers,
far-field voice remotes, predictive health and
maintenance devices, smart security devices,
and smart home devices and is targeted for use
with always-on voice processing.
The Ambiq Apollo4 chip is one of the early
announcements of embedded products using
MRAM memory produced by a semiconductor
foundry. Everspin announced that the company
had shipped over 120 M discrete MRAM chips,
mostly for small nonvolatile cache applications.
Everspin partnered with GLOBALFOUNDRIES,
another semiconductor foundry company to make
300 mm wafers for Everspin. GLOBALFOUNDRIES
is also offering its own MRAM embedded products,
with a focus on the automotive market.

Embedded and discrete MRAM products are
expected to grow in use and thus increase the
shipped memory capacity in coming years as
shown in Figure 2.3 Also shown in this chart is the
expected memory growth of 3-D XPoint (Intel's
Optane) technology, as use of this product grows
in SSD and DIMM memory socket applications, particularly in enterprise and data center applications, often tied to the use of Intel's advanced
server chips. The chart also shows expected
growth of DRAM and NAND flash memory for comparison to the emerging memory trends.
Emerging memory technologies such as MRAM,
RRAM, and phase change memory (such as Intel's
Optane) will displace conventional memories for
consumer as well as data center applications. Using
these nonvolatile memory technologies in consumer devices will enable longer battery life and
more capability for the devices that make life interesting and keep us healthy and safe.

& REFERENCES
1. T. Coughlin, " AI inference and storage, " IEEE
Consum. Electron. Mag., vol. 9, Issue. 1, Jan. 2020.
2. T. Coughlin, " Emerging memories for IoT and compute
from TSMC, Intel and IBM, " forbes.com, Sep. 4, 2020.
3. T. Coughlin and J. Handy, " Emerging memories find
their direction, " Coughlin Associates, Jun. 2020.

Figure 2. Projected growth of MRAM and 3-D XPoint
Memory compared to DRAM and NAND (Image used
with permission from Coughlin Associates).

52

Tom Coughlin is the President of Coughlin Associates, Atascadero, CA, USA. He is a regular storage
and memory contributor for forbes.com and M&E
organization websites. He is an IEEE Fellow, PastPresident of IEEE-USA, and is active with IEEE, SNIA,
and SMPTE. Contact him at tom@tomcoughlin.com.

IEEE Consumer Electronics Magazine



http://www.forbes.com http://www.forbes.com

IEEE Consumer Electronics Magazine - March/April 2021

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