IEEE Consumer Electronics Magazine - January/February 2024 - 3

COLUMNS & DEPARTMENTS
IEEE CONSUMER ELECTRONICS MAGAZINE EDITORIAL BOARD
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EDITOR-IN-CHIEF
Norbert Herencsar
Department of Telecommunications
Faculty of Electrical Engineering
and Communication
Brno University of Technology,
Czech Republic
herencsn@ieee.org
PAST EDITORS-IN-CHIEF
Peter Corcoran
National University of Ireland, Galway
dr.peter.corcoran@ieee.org
Saraju P. Mohanty
University of North Texas, USA
Shingo Yamaguchi
Yamaguchi Univeristy, Japan
SENIOR ASSOCIATE EDITORS
Wen-Huang Cheng
National Yang Ming Chiao Tung
University, Taiwan
whcheng@nycu.edu.tw
Kim-Kwang Raymond Choo
University of Texas at San
Antonio, USA
raymond.choo@fulbrightmail.org
ASSOCIATE EDITORS
Bruce, Chiu-Wing Sham
University of Auckland,
New Zealand
b.sham@auckland.ac.nz
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Electronics Industries
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Vinay Chamola
Birla Institute of Technology
and Science - Pilani, India
vinay.chamola@pilani.bits-pilani.
ac.in
Yen-Lin Chen
National Taipei University
of Technology, Taiwan
ylchen@mail.ntut.edu.tw
Kapal Dev
Munster Technological University,
Ireland
kapal.dev@ieee.org
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SPONSORING SOCIETY
PRESIDENT
Wen-Chung Kao
National Taiwan Normal University,
Taiwan
jungkao@ntnu.edu.tw
Haiwei Dong
Huawei Technologies, Canada
haiwei.dong@ieee.org
Ahmed Farouk
Wilfrid Laurier University; South
Valley University, Canada; Egypt
ahmedfarouk@ieee.org
Jianlong Fu
Microsoft Research, China
jianf@microsoft.com
Keke Gai
Beijing Institute of Technology,
China
gaikeke@bit.edu.cn
Dan Grois
Comcast Corporation, Israel
grois@ieee.org
Pao-Ann Hsiung
National Chung Cheng
University, Taiwan
pahsiung@csie.io
COLUMNISTS
Bob Frankston
Frankston.com, United States
IEEECEMagazine@bob.ma
Fabrizio Lamberti
Politecnico di Torino, Italy
fabrizio.lamberti@polito.it
Vicente F. Lucena Jr
Federal University of Amazonas,
Brazil
vicente@ufam.edu.br
Zhihan Lv
Uppsala University, Sweden
lvzhihan@gmail.com
Lia Morra
Politecnico di Torino, Italy
lia.morra@polito.it
Hassnaa Moustafa
Intel Corporation, United States
hassnaa.moustafa@ieee.org
Wai Yin, Steve Mung
The Education University
of Hong Kong
mungwaiyin@hotmail.com
Vijayakumar Pandi
Anna University, India
pvijayakumar@ieee.org
Lucia Pepa
Politecnica delle Marche
University, Italy
l.pepa@staff.univpm.it
Fernando Pescador
Universidad Politécnica de
Madrid, Spain
fernando.pescador@upm.es
Mohammad Shojafar
University of Surrey,
United Kingdom
m.shojafar@surrey.ac.uk
Michael Mattioli
Goldman Sachs & Co., United States
michael.mattioli@gs.com
Qingxue Zhang
Indiana University-Purdue
University Indianapolis, USA
qxzhang@purdue.edu
Lei Shu
University of Lincoln; Nanjing
Agricultural University
United Kingdom, China
lei.shu@ieee.org
Ned Smith
Intel Corporation, United States
ned.smith@intel.com
Mehdi Sookhak
Texas AM University-Corpus
Christi, United States
m.sookhak@ieee.org
Rafael Sotelo
Quantum-South & Universidad
de Montevideo, Uruguay
rsotelo@ieee.org
Gordana Velikic
Vincula Biotech, Serbia
gvelster@gmail.com
Zheng Yan
Xidian University, China
zheng.yan@aalto.fi
Chia-Mu Yu
National Yang Ming Chiao Tung
University, Taiwan
chiamuyu@gmail.com
Abdulmotaleb El Saddik
University of Ottawa, Canada
elsaddik@uottawa.ca
Dario Sabella
Intel Corporation, Italy
dario.sabella@intel.com
IEEE CONSUMER ELECTRONICS MAGAZINE
^
JANUARY/FEBRUARY 2024
Digital Object Identifier 10.1109/MCE.2023.3320837
3
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IEEE Consumer Electronics Magazine - January/February 2024

Table of Contents for the Digital Edition of IEEE Consumer Electronics Magazine - January/February 2024
