Content Gazette - February 2022 - 16
Contents
Volume 39 | Number 1 |
January 2022
SPECIAL SECTION
SIGNAL PROCESSING FOR
ADVANCED MATERIALS
12 FROM THE GUEST EDITORS
Mary Comer, Jeff Simmons,
Steve Niezgoda, Charles A. Bouman,
and Benjamin Berkels
16 THE MARKOV RANDOM FIELD IN
MATERIALS APPLICATIONS
Mary Comer and Jeff Simmons
25 REAL-TIME INTERACTIVE
4D-STEM PHASE-CONTRAST
IMAGING FROM ELECTRON EVENT
REPRESENTATION DATA
Philipp M. Pelz, Ian Johnson,
Colin Ophus, Peter Ercius, and
Mary C. Scott
32 ALGORITHM-DRIVEN ADVANCES
FOR SCIENTIFIC CT INSTRUMENTS
S.V. Venkatakrishnan, K. Aditya
Mohan, Amir Koushyar Ziabari, and
Charles A. Bouman
44 LENSLESS X-RAY NANOIMAGING
Dog˘a Gürsoy, Yu-chen Karen
Chen-Wiegart, and Chris Jacobsen
78 DEEP LEARNING FOR OBJECT
DETECTION IN MATERIALSSCIENCE
IMAGES
Lan Fu, Hongkai Yu, Xiaoguang Li,
Craig P. Przybyla, and Song Wang
89 IN SITU TRANSMISSION
ELECTRON MICROSCOPY
Josh Kacher, Yao Xie, Sven P. Voigt,
Shixiang Zhu, Henry Yuchi,
Jordan Key, and Surya R. Kalidindi
104 PROGRESS IN MATERIALS DATA
AVAILABILITY AND APPLICATION
Chandler A. Becker and
James A. Warren
ON THE COVER
In this special issue of IEEE Signal Processing Magazine,
we take a look at the materials science field, which has
only recently begun to explore the methods of modern
data and imaging science provided by the field of signal
processing. The purpose of this special issue is to foster
greater collaboration between these two fields.
COVER IMAGE: BACKGROUND: ©SHUTTERSTOCK.COM HENRI KOSKINEN,
PUZZLE PIECES: ©SHUTTERSTOCK.COMFOCAL POINT
55 SURFING VIRTUAL WAVES TO
THERMAL TOMOGRAPHY
Péter Kovács, Bernhard Lehner, Gregor
Thummerer, Günther Mayr, Peter
Burgholzer, and Mario Huemer
PG. 8
68 A PHYSICS-INFORMED NEURAL
NETWORK FOR QUANTIFYING THE
MICROSTRUCTURAL PROPERTIES
OF POLYCRYSTALLINE NICKEL
USING ULTRASOUND DATA
Khemraj Shukla, Ameya D. Jagtap,
James L. Blackshire, Daniel Sparkman,
and George Em Karniadakis
PG. 126
IEEE SIGNAL PROCESSING MAGAZINE (ISSN 1053-5888) (ISPREG) is published bimonthly by the Institute of Electrical and Electronics Engineers, Inc., 3 Park Avenue, 17th Floor, New York,
NY 10016-5997 USA (+1 212 419 7900). Responsibility for the contents rests upon the authors and not the IEEE, the Society, or its members. Annual member subscriptions included in Society fee.
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Printed in the U.S.A.
Digital Object Identifier 10.1109/MSP.2021.3118522
www.signalprocessingsociety.org [14] FEBRUARY 2022
IEEE SIGNAL PROCESSING MAGAZINE | January 2022 |
IEEE SIGNAL PROCESSING MAGAZINE | May 2021 |
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http://www.signalprocessingsociety.org
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