IEEE Microwave Magazine - September/October 2018 - 129

IEEE LAMC
2018

IEEE-LAMC 2018
December 12-14, 2018 - Arequipa, Peru.
http: //lamc-ieee.org

CALL FOR PAPERS
General Chair
Guillermo Rafael-Valdivia

The Technical Program Commitee of the 2018 IEEE MTT-S Latin America Microwave
Conference (LAMC) wishes to invite original contributions to this event. The conference
includes, but is not limited to, the following topics:

Universidad Catolica San Pablo

grafaelv@ucsp.edu.pe
General Co-Chair
Patrick Roblin

Ohio State University
roblin.1@osu.edu
Technical Program Committee Chair
Efrain Zenteno-Bolaños

RF systems and applications
(microwave systems and front-ends
industrial scientific and medical
applications, navigation systems,
intelligent transportation systems,
imaging, sensors, wireless power
transmission).

Comunication systems (terrestrial,
vehicular, satellite
and indoor
applications, wireless and cellular
commication systems).

ezenteno@ucsp.edu.pe
Technical Program Committee Co-Chair
Georgia Tech, Atlanta
etentze@ece.gatech.edu

Active devices, circuits and
subsystems (RFICs & MMIC design,
power amplifers, linearization
techniques, low-noise circuits, signal
generation, conversion & control
modules, linear and non-linear
modeling and characterization).

Universidad Catolica San Pablo

Emmanouil Tentzeris

Passive components, circuits and
devices ( planar and nonplanar
components and circuits, filters and
multiplexers, tunable devices, and
metamaterials).

gfernandezdc@ucsp.edu.pe
Financial Chair (treasurer)
Efrain Mayhua-Lopez
Universidad Catolica San Pablo
emayhua@ucsp.edu.pe
Exhibits Chair
Agustin Vijande
Keysight
agustinvijande@aqtk.com.pe

Active antennas (phase arrays,
integrated antennas, smart antennas,
digital-beam forming and MIMO).

Signal-power integrity and highspeed digital techniques (EM
interference and compatibility, highspeed interconnects, post-silicon
validation techniques, power delivery
networks, computer simulations and
measurements).

CAD techniques for RF and microware
engineering (surrogate -based
modeling and optimization, space
mapping-based methods, model
o rd er red u c ti on tec hniq u es,
statistical analysis and design, EMbased and multiphysics design
optimization, EM field theory, time
and frequency-domain numerical
techniques).

DEADLINES

Publications Chair
Gonzalo Fernandez Del Carpio

Proposals for special sessions and tutorials: July, 09, 2018
Papers submission: August, 06, 2018
Notification of acceptance: October, 08, 2018
Accepted papers submission: November, 08, 2018
Papers submitted to LAMC 2018 will be peer reviewed and evaluated based on originality, quantitative
contents, clarity, and interest to the audience. The review process will be single-blind. LAMC will use
IEEE EDAS as the electronic paper management system. All accepted and presented papers will be
published in the LAMC Conference Proceedings and submitted for inclusion in the IEEE Xplore Digital
Library.
English will be the official language of the conference. Prospective authors are cordially invited to
submit a three - page two-column manuscript, following the instructions available at the conference
website (http://lamc-ieee.org).

EXHIBIT & SPONSORSHIP
The IEEE MTT-S Latin America Microwave
Conference also offers an outstanding
exhibition and sponsorship opportunity.
Please contact our Exhibits Chair.

http: //lamc-ieee.org
Digital Object Identifier 10.1109/MMM.2018.2853318

MTT -S

http://iamc-ieee.org http://www.lamc-ieee.org http://iamc-ieee.org

Table of Contents for the Digital Edition of IEEE Microwave Magazine - September/October 2018