IEEE Microwave Magazine - May 2016 - 87

15-18 January 2017, Hyatt Regency, Phoenix, AZ

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Dead 16
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24 Ju

http://www.radiowirelessweek.org/
Steering Committee
General Chair
Jeremy Muldavin, MIT Lincoln
Laboratory
General Co-Chair
Rashaunda Henderson,
University of Texas, Dallas
Technical Program Chair
Hermann Schumacher, Ulm
University
Finance Chair
Robert Caverly, Villanova
University
PAWR Co-Chairs
Gayle Collins, Intel
Andrei Grebennikov, Microsemi
WiSNet Co-Chairs
Luca Roselli, University of Perugia
Alexander Koelpin, Univ. of
Erlangen-Nuremberg
Rahul Khanna, Intel
SiRF General Chair
Dietmar Kissinger, IHP
Microelectronics
Executive Committee
Chair
Charlie Jackson, Northrup
Grumman
Special Sessions Chair
Ahmet Cagri Ulusoy, IHP
Microelectronics
Conference Management
Elsie Vega, IEEE

Call For Papers
The 2017 IEEE Radio and Wireless Symposium (RWS2017) will be held during the
week of 15 January 2017 in Phoenix, AZ, USA.
RWS2017 and the 17th IEEE Topical Meeting on Silicon Monolithic Integrated
Circuits SiRF2017 are co-located and will continue to hold joint sessions. Topical
conferences held in parallel provide more focused sessions in the areas of RF Power
Amplifiers (PAWR), Wireless Sensors and Sensor Networks (WiSNet). The RWS
Demonstration Track provides an interactive forum for hands-on demonstration of latest
wireless experiments and innovations.
RWS Papers featuring innovative work are solicited in (but not limited to) the following areas:
1. High-speed and Broadband Wireless
Technologies
* Broadband Fixed Wireless and Last-Mile Access
* Ultra-High Data Rate Communications Links Powerline Communication Technologies
* 3G/4G Wireless Communication Services
* Ultra-Wideband (UWB) Systems
* Optical Networks and Systems

2. Emerging Wireless Technologies and
Applications
*
*
*
*
*

M2M & V2V Technologies & Applications
Resource Management, Security
Femtocell and Heterogeneous Networks
Satellite Network Systems
Green, Sustainable Wireless Tech. & Networks Advances in LANs, PANs, BANs, MANs, RANs

6. Applications to Bio-medical, Environmental,
and Internet of Things
* Miniaturization and integration of wireless technologies
and micro sensors
* Personal area networks and body area sensor networks
* Wireless positioning technologies & remote sensing

7. MIMO and Multi-Antenna Communications
* MIMO, MU-MIMO, Space-Time Processing - Relaying
Technologies
* Cooperative/Collaborative Technology
* Multi-Beam Smart Antennas

8. Antenna Technologies

* Passive & Active Antennas from RF to THz Frequencies
* Miniaturized, Multi-frequency and Broadband Antennas
* Wireless Platform Integrated Antennas - Vehicular and
Satellite Antennas

3. Wireless System Architecture and
Modeling

9.Transceiver & Front-end Technologies, SOC
& SiP

4. Propagation/Channel Modeling and
Utilization

10. Passive Components & Packaging

*
*
*
*

Ad Hoc Network Techniques for Internetworking
Distributed Network Architectures
Cellular Architectures and Systems
Wireless Mesh and Broadband Local/Personal/ Body
Area Networks
* Wireless Security and RFID Technologies

* Propagation/Channel Characterization & Modeling Fading Countermeasures
* Spectrum Sensing Technologies
* Frequency and Channel Allocation Algorithms

5. Digital Signal Processing, SDR, &
Cognitive Radio

* Digital/Analog Adaptive/Collaborative Signal Processing
* Methods for Maintaining Signal Integrity and Signal
Conditioning
* Interference mitigation and Cancellation Techniques
* Software/Hardware architectures, Algorithms
* MAC, Networking protocols, Regulatory Policies,
Standardization
* Dynamic Spectrum Sharing, Coexistence,
Interoperability

* Receiver, Transmitter and Transceiver Components Active Circuits and Sub-systems
* Multi-Standard Circuits and Sub-systems
* Low-Power/Low Noise RF/Analog IC and System-OnChip
* Highly Integrated Transceivers for Sensing and Imaging
*
*
*
*

Discrete, Embedded and Distributed Passive components
Filters, Couplers and Signal Separation Devices
Discrete and Highly Integrated Packaging
3D-packaging, Interconnects, TSV Technologies and
Applications
* Packaging of MEMs, Biosensors, Organic ICs, THz
Electronics, Optoelectronics - Reliability Issues

11. MM-Wave to THz Technology &
Applications

* Device and circuit concept & demonstration
* Unique receivers and transmitters - Integrated circuits
* Wireless links, Arrays & Applications

12. 3D & Novel Engineered Materials

* Additive 3D manufacturing for wireless components and
systems
* Novel engineered materials for antenna, packaging, passive
devices and flexible electronic integration

Paper submission instructions will be found at http://www.radiowirelessweek.org/. Submissions should be formatted according to
the submission review. Authors should indicate their preference for oral or poster presentation. All submissions must be
received by 24 July 2016.
All accepted papers will be published in a digest and and be included in IEEE Digital Library Xplore. Submission will be
evaluated based on novelty, significance of the work, technical content, interest to the audience, and presentation.
Digital Object Identifier 10.1109/MMM.2016.2538504
http://www.radiowirelessweek.org/ http://www.radiowirelessweek.org/
Table of Contents for the Digital Edition of IEEE Microwave Magazine - May 2016
