IEEE Microwave Magazine - May 2017 - 50

Table 1. IMS2017 workshops. (continued)
Day

Code

Duration

Title/Organizers

Monday

WMD

Half day

Flexible Devices, Circuits, and Systems Solutions in RF and mmW Front Ends for 5G Cellular
Communications
Prof. Eric Kerherve and Dr. Vincent Knopik
abstract: The continuing growth in demand for high data rates is driving 5G cellular communications. These
communications need to be flexible enough to accommodate present and future diverse uses. Available
mmW bands are able to respond to the increasing data traffic because new technologies and innovative circuit
topologies can offer system flexibility. Another critical challenge for the future 5G is the output power over
a large frequency range maintaining high-linearity (to address complex modulation schemes) and low-cost
requirements. This demands other complex solutions, implementing beamforming networks, for instance,
having the advantage of spectral flexibility but practical constraints imposed by the front-end circuit itself. In
this workshop, academic and industry experts will focus on flexible devices, circuits, and systems solutions
used (or imagined) in different RF and mmW front ends that could pave the way for foming 5G cellular
communications.

Monday

WME

Half day

Front-End Module for 5G
Prof. Vittorio Camarchia, Prof. Roberto Quaglia, and Prof. Anh-Vu Pham
abstract: In this workshop, speakers from leading industries and universities will present state-of-the-art
results in the framework of 5G front-end modules (FEMs). Several aspects regarding FEMs will be covered,
from the motivations that drive their development to advanced testing. First, the main trends and challenges
for FEMs will be shown from the standpoint of a regulatory body, and commercial aspects will be highlighted.
Results regarding the design of energy-efficient FEMs will be presented, considering both compound and Si
technologies and focusing on the pros and cons deriving from integration. Integrated solutions for mmW ICs
will be described and the consequences of increasing center frequency and bandwidth carefully evaluated.
Some aspects regarding packaging technologies will be also presented. The important aspect of receiver/
transmitter isolation will be also be discussed, including a description of integrated circulator/isolator solutions
based on linear, periodic, time-varying circuits.

Monday

WMF

Half day

High-Power WPT
Prof. Alessandra Costanzo and Prof. Zoya Popovic
abstract: High-power wireless power transmission (WPT) is a key technology, gaining increasing interest
in many industrial sectors, ranging from automotive (for electric vehicle charging "on the move") to complex
distributed industrial plants located in harsh environments (for simultaneously powering movable parts and
sensing and data transfer). The most common operating frequency is in the range of a few hundred kilohertz,
but now there are emerging solutions in the MHz range, thanks to device technology evolution. This half-day
workshop will present some of the latest results, addressing both theory and system aspects down to the
circuit-level perspective, from a few watts up to a few kilowatts considering the EM safety issue. Applications
for transportation and large industrial plants are presented by the speakers from four different continents.

Monday

WMG

Full day

New Developments in Microwave Measurements for Planar Circuits and Components
Dr. Matthias Ohlrogge and Dr. Uwe Arz
abstract: High-frequency, on-wafer measurements are fundamental for many applications in science,
engineering, and metrology. While reliable planar measurements up to mmW frequencies are becoming
more and more state of the art, traceability in an industrial characterization process, planar S-parameter
measurements of nanodevices, and the extension to frequencies beyond 100 GHz are still open topics within
the scientific and industrial communities. The aim of this workshop is to overview these current research areas
and present future directions in the field of planar, on-wafer measurements. The first part will consider the
fundamental question of how to achieve traceability in planar, on-wafer measurements. More specifically, we
will discuss the characterization and verification process of different error mechanisms in a planar, on-wafer
environment. The second part is linked to the measurement of nano-electronic devices.
(continued)

May 2017

Table of Contents for the Digital Edition of IEEE Microwave Magazine - May 2017