IEEE Microwave Magazine - May 2017 - 61

Table 1. IMS2017 workshops. (continued)
Day

Code

Duration

Title/Organizers

Friday

WFP

Full day

Plug-and-Play S-Parameter Measurements and Models for Broadband Interconnects
Dr. Mike Resso and Dr. Heidi Barnes
abstract: This workshop will provide an industry perspective on interconnect issues involving referenceplane placement and the subsequent impact on achieving high-quality broadband S-parameter measurements
and models. An overview will be provided beginning with the historical challenges of the simple coaxial
connector to understanding the latest in low-power, high-density, high-speed interconnects for the IoT. This
IOT industry is rapidly moving toward new standards, such as the USB type-C reversible interconnect that
runs at 10-Gb/s data rates, creating microwave frequencies, and is capable of 100 W of power all in a printed
circuit board (PCB) footprint smaller than a single-edge-launch subminiature A-to-PCB connector. Ensuring
error-free data transmission requires the ability to plug and play S-parameter models of various components
for design exploration, turn-on debug, and compliance verification. Measurement calibrations and simulation
reference planes need to pay careful attention to the definition and location of the S-parameter reference
planes to insure their accuracy when cascaded in a full-channel simulation across both time and frequency
domains. Adding to the complexity is the high-density coupling and crosstalk for signal-integrity applications
and the extremely low impedances on the power-integrity side. This special session will include world
experts in these engineering disciplines, including from academia, to provide practical tips and techniques for
measuring and modeling interconnects with custom calibration and simulation reference planes.

Friday

WFQ

Full day

Recent Progress in mmW Multilayer Circuit and System Design and Packaging
Dr. Kamal Samanta and Prof. Maurizio Bozzi
abstract: This workshop will cover recent advances and state-of-the-art development in 3-D and multilayer
mmW multichip module (MCM) and system-on-package (SoP) technologies. Topics will include multilayer
AM, such as inkjet, 3-D, and aerosol printing, for realizing advanced, high-quality embedded passive
components, circuits, and 3-D stacked and MCM/SoP architectures. At the same time, the workshop will
present important progress in highly integrated multilayer ceramic-based circuits (including active broadside
and end-fire antenna arrays for 5G) and systems [such as WiGig at 60 GHz and 5G systems at 38 GHz,
space-qualified systems at Ka-band, and 60-GHz air-plane wireless local area network (WLAN) systems],
using ceramic-stereolithography and subtractive printing technologies (e.g., low-temperature cofired ceramic,
liquid crystal polymer, and photoimageable thick film). Further, it will present the novel nanofabrication of
carbon nanotube-based sensors on flexible substrates and mmW interconnects for flip-chip integration and
packaging. The workshop will also provide various examples in the area of multifunction packaging, high-Q
passives and energy harvesting/transfer techniques, the IoT, flexible platforms, wearable electronics, 60-GHz
WLAN and WiGig and sensor networks, and 5G systems (including analog/RF beamforming).

Friday

WFR

Full day

RFID Components and Devices for the Next Generation of 5G IoT Devices
Prof. Jasmin Grosinger and Prof. Thomas Ussmueller
abstract: When 5G arrives in 2020, engineers expect that it will be able to handle about 1,000 times more
mobile data than today's cellular systems. 5G will then be the backbone of the IoT, linking up fixed and
mobile devices and becoming part of a new industrial and economic revolution. RFID technology is one of
the key enabling technologies for the IoT. The main benefit of RFID systems for IoT devices is the possibility
to operate these devices batteryless. Hence, no maintenance for the wireless interface is necessary, resulting
in a theoretically unlimited lifetime for wireless IoT devices. To be prepared for the arrival of 5G and the next
generation of 5G IoT devices, RFID components and devices should offer reliable, robust operation and
functionalities. The workshop will cover a collection of important topics on RFID components and devices for
the next generation of 5G IoT devices including antenna design for RFID, energy harvesting, novel technology
developments, and use cases for RFID-based sensor nodes.
(continued)

May 2017

Table of Contents for the Digital Edition of IEEE Microwave Magazine - May 2017