IEEE Solid-States Circuits Magazine - Spring 2018 - 4

contributors

ANDRÉ DEHON is a
professor in the De-
partment of Electrical
a nd System s E ng i-
neering at the Univer-
sity of Pennsylvania
and chair of the ACM SIGDA Technical
Committee on FPGAs and Reconfigu-
rable Computing.

MIKE DINI is presi-
dent of the Dini Group,
based in La Jolla, Cali-
fornia, which designs fi-
eld-programmable-gate-
array-based products.

JOHN p. KEANE is
with Keysight Technol-
ogies, in Santa Clara,
California, where his
research focuses on
high performance ICs
for measurement applications.

KENNEtH C. DyER is
with Rambus, in
Sunnyvale, Califor-
nia, where he is a se-
nior principal data
converter architect.

StEpHEN H. LEwIS is
a professor in the De-
partment of Electrical
and Computer Engi-
neering at the Universi-
ty of California, Davis.

Digital Object Identifier 10.1109/MSSC.2018.2822579
Date of publication: 22 June 2018

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Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2018

Contents
IEEE Solid-States Circuits Magazine - Spring 2018 - Cover1
IEEE Solid-States Circuits Magazine - Spring 2018 - Cover2
IEEE Solid-States Circuits Magazine - Spring 2018 - Contents
IEEE Solid-States Circuits Magazine - Spring 2018 - 2
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IEEE Solid-States Circuits Magazine - Spring 2018 - Cover3
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