IEEE Solid-States Circuits Magazine - Summer 2018 - 73

IEEE SSCS Benelux Chapter Organizes Its Third Workshop
at Katholieke Universiteit Leuven

O

On 22 May 2018, the IEEE Solid-State
Circuits Society (SSCS) Benelux Chapter held its third annual workshop.
The event was held at Katholieke Universiteit (KU) Leuven, Belgium, and
25 Chapter members attended. The
workshop brought Chapter members
together for a common passion of IC
design. The winners of the 2017 Chip
Design Contest shared their awardwinning entries.
After an introduction about the
IEEE SSCS Benelux Chapter by Prof.
Patrick Reynaert, prizes were awarded
to the three winners of the Chip
Design Contest:
■ first place: Nicolas Butzen, KU
Leuven
■ second place: Zhao Chen, Delft
University of Technology, The
Netherlands
Digital Object Identifier 10.1109/MSSC.2018.2844617
Date of publication: 13 August 2018

Patrick Reynaert (right) presents Nicolas
Butzen with the first-place prize.

third place: Marijn Verbeke, Ghent
University, Belgium.
The workshop continued with talks
by the three award recipients regarding their chips.
In the afternoon, the audience
enjoyed three talks given by academic, research, and industry experts.

■

Prof. Ingrid Verbauwhede, KU Leuven,
discussed the importance of circuit
design for secure chips; Nick Van Helleputte, imec, Leuven, Belgium, talked
about high-density neural interfaces;
and Wouter Leten, Melexis, Ypres, Belgium, closed the technical afternoon
session with a lecture on design for
automotive applications.
After the technical sessions, a networking reception was held to give
workshop participants the opportunity
to further interact with each other.
Later this year, the IEEE SSCS Benelux Chapter will organize a chip
design contest that will be open to
bachelor's, master's, and Ph.D. degree
students. More information about
this contest will be available in the
fall of 2018.

-Filip Tavernier
-Patrick Reynaert

From left: Prof. Patrick Reynaert (KU Leuven, Chapter chair), Prof. Filip Tavernier (KU Leuven, treasurer), Nicolas Butzen (KU Leuven, first-prize
recipient, 2017 Chip Design Contest), Zhao Chen (Delft University of Technology, second-prize recipient, 2017 Chip Design Contest), Marijn
Verbeke (Ghent University, third-prize recipient, 2017 Chip Design Contest), and Prof. Pieter Rombouts (Ghent University).

IEEE SOLID-STATE CIRCUITS MAGAZINE

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IEEE Solid-States Circuits Magazine - Summer 2018

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Summer 2018

Contents
IEEE Solid-States Circuits Magazine - Summer 2018 - Cover1
IEEE Solid-States Circuits Magazine - Summer 2018 - Cover2
IEEE Solid-States Circuits Magazine - Summer 2018 - Contents
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