IEEE Solid-States Circuits Magazine - Summer 2018 - 95

our CICC Ph.D. student sponsorship initiative program to attract more student
attendees and future student paper
authors. The program is aimed at providing travel supports for all first- and
second-year Ph.D. students worldwide
who have not previously attended CICC.
A total of ten Ph.D. students were
selected for the 2018 program, an increase of 43% over CICC 2017.
The CICC Committee gratefully acknowledges our generous industry
sponsors, including Silicon Labs
(platinum level), Analog Devices (gold
level), Cadence (gold level), and other
general conference and proceedings

-Kimo Tan
General Chair

sponsors, for their continuous support of the conference.
The 40th annual edition of the conference (CICC 2019) is currently in the
planning stages. It will be returning
to Austin, Texas, the heart of Silicon
Hills. The plan for future conferences
is to expand to cities such as Boston,
Massachusetts and Atlanta, Georgia.

-Ken Suyama
Media Relations Organization
Committee Chair

-Hua Wang
Technical Program Committee Chair

-Don Thelen
Steering Committee Member

-Alessandro Piovaccari
Conference Chair

-Philippe Jansen
Steering Committee Member

-Ramesh Harjani
Steering Committee Member

The IEEE SSCS Indonesia Chapter Coorganizes ISESD 2017

On 17-19 October 2017, the IEEE SolidState Circuits Society (SSCS) Indonesia
Chapter coorganized and technically
cosponsored the 2017 IEEE International Symposium on Electronics and
Smart Devices (ISESD 2017). The organizer of ISESD 2017 was the Electronics Research Group of the School of
Electrical Engineering and Informatics, Institute Teknologi, Bandung, Indonesia. The coorganizer was the SSCS
Indonesia Chapter.
ISESD 2017 was held at the MICC
Alana Hotel and Convention Center,
Yogyakarta. The event took place in collaboration with the Universitas Islam
Indonesia Yogyakarta. Dr. Amy Hamidah Salman of the Institut Teknologi
Bandung was appointed general chair
of the gathering. ISESD has become the
premier conference for groundbreaking research in the field of electronics,
smart devices, and related technologies. Conference topics included smart
Digital Object Identifier 10.1109/MSSC.2018.2844702
Date of publication: 13 August 2018

The MICC building, where ISESD 2017 was held.

device system architecture, enabling
technologies, services and applications, and social implications. Regular session topics included devices,
circuits and systems, very largescale integration, communication
systems, multimedia and systems,
signal processing, the Internet of Things,
and smart and secure devices. There

were 106 scientific papers submitted
to ISESD 2017, and 69 were accepted.
In attendance were 58 people from all
over the world.
The three-day conference consisted
of regular sessions and fun activities,
such as a city tour. Aside from the regular technical sessions, there were four
special sessions.

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IEEE Solid-States Circuits Magazine - Summer 2018

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