IEEE Solid-State Circuits Magazine - Winter 2018 - 40
OpenGL
(ES1.1)
Graphics
OpenGL/VG/MAX
(ES2.0)
WVGA
at 60 fps
Display
VGA
Camera
5~8 M
10 M
H.264/AVC
(VGA)
H.264/AVC
(D1)
Image/Video
Audio
AAC
Accelerator
Downlink
(Mb/s)
H.264/AVC
(Full HD)
H.264/MVC
H.264/SVC
WMA
Dolby 5.1
500
800
800
2,400
2,400
6,000
2010
2011
H.265/VP9
HDR
H.265/VP9
Multicore
(4-8)
LTE
100
2009
16 MX-Dual
3-D Depth/AR
Dolby
TrueHD/Digital+
HSPA+
7-42
2008
WQXGA /WQXGA+
at 60 fpsx2 (VR)
12 MX-Dual
360° VR
24 M
HSPA
1.8-7
300
500
Virtual Reality (VR)
Vulkan
WQXGA /WQXGA+
at 60 fps
20 M
SIMD
Multicore (2-4)
UMTS
0.4-2
2007
SXGA
at 60 fps
16 M
AAC Plus
FPU
CPU (MIPS)
Augmented Reality
(AR)
2012
2013
DSD
Dolby Atoms
Heterogeneous
Multiprocessing
LTE-A
150-750
Neural-Net
Processor
LTE-A
1,600
6K
12 K
2014
AV1
HDR10+
12 K
100 K
2015
LTE-A
2,000
13 K
112 K
2016
9K
162 K
2017
2018
Figure 21: AP trends in smart phones. OpenGL: Open Graphics Library; VGA: video graphics array; WVGA: wide VGA; SXGA: superextended GA; WQXGA: wide quad extended GA; AVC: advanced video coding; HD: high definition; MVC: multiview video coding; SVC: scalable video
coding; HDR: high dynamic range; AV1: AOMedia Video 1; AAC: advanced audio coding; WMA: Windows Media Audio; DSD: Direct-Stream
Digital; FPU: floating-point unit; SIMD: single instruction/multiple data; UMTS: Universal Mobile Telecommunications System; HSPA: High-Speed
Packet Access. MIPS: millions of instructions per second.
Short Links, 1 m
100-G Ethernet
Local-Area Network, 10 m
100 G
10-G Ethernet
10 G
PCIe
USB 2.0
Data Rate (Hz)
1G
USB 3.0
802.15.3d
802.11.ax
802.11.ac/ad
UWB
5G
LTE-A
802.11n
LTE
Cellular, 100 m
100 M
802.11b
10 M
1M
802.11ag
USB 1.0
HSPA
HSDPA
802.11
WiMAX
3G R99/EDGE
100 K
GSM
10 K
1995
GPRS
2000
2005
2010
2015
2020
Year
Figure 22: Data-rate trends for wired, wireless, and cellular communication. HSPA: High-Speed Packet Access; HSDPA: High-Speed Downlink
Packet Access; GSM: Global System for Mobile Communications; GPRS: General Packet Radio Service; EDGE: Enhanced Data Rates for GSM
Evolution: LTE: Long-Term Evolution; LTE-A: LTE-Advanced.
40
W I n t E r 2 0 18
IEEE SOLID-STATE CIRCUITS MAGAZINE
Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2018
Contents
IEEE Solid-State Circuits Magazine - Winter 2018 - Cover1
IEEE Solid-State Circuits Magazine - Winter 2018 - Cover2
IEEE Solid-State Circuits Magazine - Winter 2018 - Contents
IEEE Solid-State Circuits Magazine - Winter 2018 - 2
IEEE Solid-State Circuits Magazine - Winter 2018 - 3
IEEE Solid-State Circuits Magazine - Winter 2018 - 4
IEEE Solid-State Circuits Magazine - Winter 2018 - 5
IEEE Solid-State Circuits Magazine - Winter 2018 - 6
IEEE Solid-State Circuits Magazine - Winter 2018 - 7
IEEE Solid-State Circuits Magazine - Winter 2018 - 8
IEEE Solid-State Circuits Magazine - Winter 2018 - 9
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IEEE Solid-State Circuits Magazine - Winter 2018 - 11
IEEE Solid-State Circuits Magazine - Winter 2018 - 12
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IEEE Solid-State Circuits Magazine - Winter 2018 - 15
IEEE Solid-State Circuits Magazine - Winter 2018 - 16
IEEE Solid-State Circuits Magazine - Winter 2018 - 17
IEEE Solid-State Circuits Magazine - Winter 2018 - 18
IEEE Solid-State Circuits Magazine - Winter 2018 - 19
IEEE Solid-State Circuits Magazine - Winter 2018 - 20
IEEE Solid-State Circuits Magazine - Winter 2018 - 21
IEEE Solid-State Circuits Magazine - Winter 2018 - 22
IEEE Solid-State Circuits Magazine - Winter 2018 - 23
IEEE Solid-State Circuits Magazine - Winter 2018 - 24
IEEE Solid-State Circuits Magazine - Winter 2018 - 25
IEEE Solid-State Circuits Magazine - Winter 2018 - 26
IEEE Solid-State Circuits Magazine - Winter 2018 - 27
IEEE Solid-State Circuits Magazine - Winter 2018 - 28
IEEE Solid-State Circuits Magazine - Winter 2018 - 29
IEEE Solid-State Circuits Magazine - Winter 2018 - 30
IEEE Solid-State Circuits Magazine - Winter 2018 - 31
IEEE Solid-State Circuits Magazine - Winter 2018 - 32
IEEE Solid-State Circuits Magazine - Winter 2018 - 33
IEEE Solid-State Circuits Magazine - Winter 2018 - 34
IEEE Solid-State Circuits Magazine - Winter 2018 - 35
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IEEE Solid-State Circuits Magazine - Winter 2018 - 37
IEEE Solid-State Circuits Magazine - Winter 2018 - 38
IEEE Solid-State Circuits Magazine - Winter 2018 - 39
IEEE Solid-State Circuits Magazine - Winter 2018 - 40
IEEE Solid-State Circuits Magazine - Winter 2018 - 41
IEEE Solid-State Circuits Magazine - Winter 2018 - 42
IEEE Solid-State Circuits Magazine - Winter 2018 - 43
IEEE Solid-State Circuits Magazine - Winter 2018 - 44
IEEE Solid-State Circuits Magazine - Winter 2018 - 45
IEEE Solid-State Circuits Magazine - Winter 2018 - 46
IEEE Solid-State Circuits Magazine - Winter 2018 - 47
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IEEE Solid-State Circuits Magazine - Winter 2018 - 50
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IEEE Solid-State Circuits Magazine - Winter 2018 - 53
IEEE Solid-State Circuits Magazine - Winter 2018 - 54
IEEE Solid-State Circuits Magazine - Winter 2018 - 55
IEEE Solid-State Circuits Magazine - Winter 2018 - 56
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IEEE Solid-State Circuits Magazine - Winter 2018 - 81
IEEE Solid-State Circuits Magazine - Winter 2018 - 82
IEEE Solid-State Circuits Magazine - Winter 2018 - 83
IEEE Solid-State Circuits Magazine - Winter 2018 - 84
IEEE Solid-State Circuits Magazine - Winter 2018 - Cover3
IEEE Solid-State Circuits Magazine - Winter 2018 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2023
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https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2022
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