IEEE Solid-State Circuits Magazine - Winter 2018 - 79

IEEE N E WS

CEDA Currents

The following is a reprint from CEDA
Currents, November 2017 issue, a publication of the IEEE Council on Electronic Design Automation (CEDA).
Please send contributions to Jose L.
Ayala (jayala@fdi.ucm.es).

Appointments in Publications
Committees
At the end of 2017, Vijaykrishnan Nayaranan, distinguished professor of
Computer Science and Engineering
and Electrical Engineering at the Pennsylvania State University, USA, will
complete his four-year service as
editor-in-chief (EIC) for the IEEE Transactions on Computer-Aided Design of
Integrated Circuits and Systems (TCAD).
Vijay has not only done an excellent
job in keeping up the quality of TCAD
and the traditional EDA topics, he has
also developed emerging topics like
embedded systems, software and security at TCAD.
Likewise, Charles ("Chuck") Alpert, senior group director at Cadence
Design Systems, USA, will complete
his four-year service as deputy EIC of
TCAD. In this role he has succeeded
in soliciting a variety of exciting keynote papers for TCAD.
Vijay and Chuck end their service
after t wo terms according to the
IEEE rules. CEDA expresses its warm
thanks to Vijay and Chuck for their
extraordinary service to TCAD, the
flagship EDA publication.
CEDA happily announces that
Rajesh K. Gupta, QUALCOMM professor in Computer Science and Engineering at the University of California
San Diego, United States, has been
appointed TCAD EIC for the term
2018-2019. Rajesh's research interDigital Object Identifier 10.1109/MSSC.2017.2769468
Date of publication: 31 January 2018

Upcoming conferences
(Yao-Wen chang,
conferences@ieee-ceda.com)
*

ests span topics that have come to be
characterized under embedded and
cyber-physical systems and recently
under Internet-of-Things. Regardless
of the title, the focus of his research
has been on methods and tools to
make things better (e.g., tools to make
things better, such as being more
energy efficient, reliable), or enable
others (mostly designers, architects)
to do things better. Rajesh is a Fellow
of the IEEE and a Fellow of the ACM,
he has been the founder and inaugural EIC of IEEE Embedded Systems Letters (ESL).
CEDA also happily announces
that Sri Parameswaran, professor
and program director for Computer
Engineering at the University of New
South Wales, Australia, has been reappointed for the second two year
term as EIC of the ESL 2018-2019.
Likewise, Tulika Mitra, professor
of Computer Science at the School of
Computing of the National University
of Singapore, has been reappointed
as Deputy EIC of ESL.

EDPS 2017-A Great "New"
Beginning
By Shishpal Rawat, President CEDA
While the 24th edition of EDPS was,
as they say in its 24th year, it was in
many ways a new beginning for the
symposium.
As the design process has evolved
and become more integrated with
manufacturing to package more components in a die (Moore's Law), we
brought in our manufacturing partners to describe how these new design

ICCAD
Irvine, United States
13-17 November

and manufacturing processes could
better work together to improve yield
and HVM thereby reducing overall cost
of the system.
SEMI became an associate sponsor of the event providing us with
impeccable facilities to hold the
symposium in Milpitas, CA. Time and
location was moved from April, Monterey to September, Milpitas to come
closer to many practicing engineers
which allowed them to participate
with minimal disruption to their busy
work schedules.
We easily surpassed our attendance goal and ended up with a total
of 81 attendees (with some attendees signing up at the door). The sessions presented thought-provoking
subjects (machine learning, yield
improvement, design acceleration
and debug/validation) over the
course of two days. The Q&A and
follow up sessions led to interesting
discussions and attendees enjoyed
valuable networking opportunities

IEEE Embedded Systems Letters is open for
submissions. Visit mc.manuscriptcentral
.com/les-ieee.
IEEE Design & Test is open for submissions. Visit mc.manuscriptcentral.com/
dandt and ieee-ceda.org/publications/
d-t/paper-submission.

IEEE SOLID-STATE CIRCUITS MAGAZINE

W I N T E R 2 0 18

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Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2018