IEEE Solid-States Circuits Magazine - Spring 2019 - 42

Behzad Dehlaghi, Nijwm Wary,
and Tony Chan Carusone

BACKGROUND: FOOTAGE FIRM, INC.

Ultra-Short-Reach
Interconnects for
Die-to-Die Links
Global bandwidth demands in microcosm

T

o meet the ever-increasing demand of global
data traffic, the Hybrid
Memory Cube (HMC)
specification and HighBandwidth Memory standard call for
an aggregate bandwidth of 8 Tb/s in
next-generation memory-to-processor
links [1], [2]. At the same time, the
data rates processed by individual line
cards in data center switches will soon
go beyond 25 Tb/s [3]. However, as
the data rate of serial links over copper interconnects increases, the links
Digital Object Identifier 10.1109/MSSC.2019.2910619
Date of publication: 24 June 2019

42

S P R I N G 2 0 19

appear highly lossy. Further, the power
consumption of a wireline transceiver,
including all clocking and equalization circuits, increases. Publications
suggest a tenfold increase in power
consumption with a 30-dB increase
in channel loss [4]. Hence, energyefficient communication equipment
should be engineered to keep the channel loss as low as possible.
The total input-output (I/O) bandwidth demanded of a high-performance application-specified integrated
circuit is almost doubling every two
years, while the number of pins per
package doubles only every six years
[3]. As a result, the bandwidth per pin

IEEE SOLID-STATE CIRCUITS MAGAZINE

is increasing. While the active area for
I/O circuitry benefits from CMOS scaling, conventional board-level integration on a printed circuit board (PCB)
limits the achievable bandwidth density for chip-to-chip communication.
Figure 1(a) illustrates the board-level
integration of two dies. If we consider
a chip package of 70 mm × 70 mm, with
the minimum pitch available (approximately 0.5 mm in current packaging
technology) for a ball grid array (BGA),
the possible number of I/Os in the two
outer rows of balls (with some ground
BGAs allocated to limit crosstalk) is
approximately 280 on each side. This
is equivalent to having 140 differential

1943-0582/19©2019IEEE



IEEE Solid-States Circuits Magazine - Spring 2019

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2019

Contents
IEEE Solid-States Circuits Magazine - Spring 2019 - Cover1
IEEE Solid-States Circuits Magazine - Spring 2019 - Cover2
IEEE Solid-States Circuits Magazine - Spring 2019 - Contents
IEEE Solid-States Circuits Magazine - Spring 2019 - 2
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