IEEE Solid-States Circuits Magazine - Spring 2019 - 5

to facilitate new technology development and system performance scaling.
This has been fed by the persistent demand for memory access and the push
toward high-core-count integration
as well as the emerging and evolving
compute platforms. The innovative solutions presented in this issue suggest
that the parallel, single-ended wireline interface is not simply a legacy
embodiment carried over to maintain
backward compatibility; rather, it will
be a key enabler of many of the most
critical applications of the future.
This issue also includes several
feature articles of interest to IEEE
Solid-State Circuits Magazine readers

CONTRIBUTORS

that range from tutorials to technology overviews. These include the
popular editorials and tutorials from
Marcel Pelgrom and Behzad Razavi.
In addition to these contributions,
Daniel Bankman, Andrew Yu, Kevin
Zheng, and Boris Murmann provide the first of a two-part article on
metastability in successive approximation register analog-to-digital
converters. Also, Yanchao Wang and
Gabor C. Temes contribute an article
on scaling for optimum dynamic range
in analog circuits.
The goal of the magazine continues to be to provide Society news and
information as well as a series of self-

contained resources to keep the IEEE
Solid-State Circuits Society member
up to date with changes in technology
while, at the same time, providing reviews of circuit-design concepts. This
includes contributions from experts
describing the current state of affairs and evolution of a particular IC
technology. We will also continue to
feature articles focused on the contributions of luminaries and solid-state
circuit techniques and directions. We
hope you enjoy reading IEEE SolidState Circuits Magazine. Please send
comments to me at rjacobbaker@
gmail.com.

(continued from p. 3)

PHILIPPE LANCHERES
is a senior member
of the technical staff
at Introspect Technology, Montréal, Canada.

AMIN SHOKROLLAHI
is the chief executive officer of Kandou Bus, Lausanne, Switzerland.

BORIS MURMANN is
a full professor in
the Department of
Electrical Engineering, Stanford University, California.

MOHAMED HAFED is
the chief executive
officer of Introspect
Technology, Montréal,
Canada.

DANIEL BANKMAN is
a Ph.D. degree candidate
in the Department of
Electrical Engineering,
Stanford University,
California.

YANCHAO WANG is a
Ph.D. degree student
at Oregon State University, Corvallis.

ARMIN TAJALLI is an
assistant professor
in the Electrical and
Computer Engineering Department at the
University of Utah,
Salt Lake City.

ANDREW YU is a Ph.D.
deg r e e st ude nt i n
electrical engineering
and computer science
at the Massachusetts
Institute of Technology,
Cambridge.

GA B O R C . T E M E S
is a distinguished
professor emeritus
at the University of
California, Los Angeles, and a professor
at Oregon State University, Corvallis.

ALI H O R M ATI i s a
senior signal integr it y a nd modeling
engineer with Kandou Bus, Lausanne,
Switzerland.

KEVIN ZHENG is a
s t a f f mixed-signal
design engineer with
the SerDes Technology
Group at Xilinx, San
Jose, California.

IEEE SOLID-STATE CIRCUITS MAGAZINE

S P R I N G 2 0 19

5
IEEE Solid-States Circuits Magazine - Spring 2019

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2019
