IEEE Solid-States Circuits Magazine - Fall 2019 - 48
Prosthetic devices are robust and
durable and offer users a great degree
of freedom [20]-[22]. The close-loop
control of, for example, a robotic arm
based on visual feedback is enabled
by the connections between the prosthetic device and the muscles and neurons in the remaining part of the arm.
However, a prosthetic hand that cannot feel is considered useless because
the amputee does not get feedback
about where it is and how much force
he or she needs to apply to grab an
object. Thus, the U.S. Defense Advanced Research Projects Agency
(DARPA) started the Hand Proprioception and Touch Interfaces program focused on bringing that sensory
feedback to prosthetic hands. The objective is to achieve bidirectional communication between the brain, the
implant that is interfacing with the
nerves, and the prosthetic device;
this is possible thanks to recent
prosthetics that include fingertip
and joint sensors [23]. To achieve
bidirectional communication, the
interface implant needs to integrate
high-performance stimulation and
recording functionality.
Within the DARPA program, a highdensity CMOS microelectrode probe was
designed to be embedded into a fully
biocompatible and hermetic package
[24]. As shown in Figure 10, that flexible device can be implanted through
the nerve in a transversal manner to
record and stimulate individual nerve
bundles. In that way, the interaction
between the brain and the prosthetic
device is improved. The high-level circuit architecture of the CMOS probe is
presented in Figure 11 and consists of 64
recording and 16 stimulation electrodes
connected to 16 readout channels and
16 stimulation units. The probe connects
to a backed chip that is responsible for
providing biasing, digital control, analogto-digital conversion, and a spike-detection engine. The technology developed
to encapsulate the probe [25] involved
the stacking of very thin polymer and
barrier layers to create an ultrathin
and flexible electronic device (see Figure 12). That encapsulation enables the
chronic implantation of the device without corrosion and electrical damage.
Technology Outlook
As seen in the examples discussed
previously, neural technology requires
the close interaction of different fields
such as
1) CMOS technology and circuit techniques to bring advanced functionality to neural probes and
Hermetic and Biocompatible
Package
Transversal Implantation
Nerve
Switch
Matrix
×32 Recording Pixels
×16 Stimulation Units
×32 Recording Pixels
Digital Unit
×8 Readout Channels
×8 Readout Channels
500 µm
FIGURE 10: The fully fabricated and encapsulated high-density microelectrode CMOS probe reported in [24]. The device is fully hermetic, biocompatible, and flexible [26].
48
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IEEE SOLID-STATE CIRCUITS MAGAZINE
IEEE Solid-States Circuits Magazine - Fall 2019
Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Fall 2019
Contents
IEEE Solid-States Circuits Magazine - Fall 2019 - Cover1
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IEEE Solid-States Circuits Magazine - Fall 2019 - Contents
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