IEEE Solid-States Circuits Magazine - Fall 2020 - 127

challenges and futures
interactive, workAs computing
of system-level intershop-like tone and
systems and
connect, coming from
format (recalling earlier
applications
w ide -r a n g i n g b a c keditions of the SLIP
grapple with a
g r o u n d s t h a t sp a n
workshop) is a go a l
post-Moore, postsystem, application,
for SLIP^2 this year.
CMOS, post-von
design, and technology.
Or ig ina l submisNeumann future,
The technical goal of the
s i o n s i n t h e fo r m
fundamental
interconnect
workshop is to identify
of regular technical
problems
and
fundamental problems
papers, invited sespathfinding
and foster new pathfindsions (tutorials, panels,
challenges have
ing of design, analyspecial-topic sessions),
become more
sis, and optimization
workshop discussion
critical to address
of interconnect and
topics, and posters are
than ever before.
communication fabrics
welcome. Program conin electronic systems.
tent is accepted based
A special emphasis is
on novelty and contriplaced this year on predictive system
butions to the advancement of the
interconnect modeling technologies
field. Accepted technical papers will
and on novel interconnect technolobe published in the ACM and IEEE
gies and architectures for a beyonddigital libraries.

Moore era. Additionally, a more

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IEEE Solid-States Circuits Magazine - Fall 2020

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Fall 2020

Contents
IEEE Solid-States Circuits Magazine - Fall 2020 - Cover1
IEEE Solid-States Circuits Magazine - Fall 2020 - Cover2
IEEE Solid-States Circuits Magazine - Fall 2020 - Contents
IEEE Solid-States Circuits Magazine - Fall 2020 - 2
IEEE Solid-States Circuits Magazine - Fall 2020 - 3
IEEE Solid-States Circuits Magazine - Fall 2020 - 4
IEEE Solid-States Circuits Magazine - Fall 2020 - 5
IEEE Solid-States Circuits Magazine - Fall 2020 - 6
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IEEE Solid-States Circuits Magazine - Fall 2020 - Cover3
IEEE Solid-States Circuits Magazine - Fall 2020 - Cover4
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