IEEE Solid-States Circuits Magazine - Fall 2021 - 146
Events Organized by IEEE SSCS Romania Chapter
T
The IEEE Solid-State Circuits Society
Romania Chapter, consisting of about
27 members, including five student
members, three senior members, and
two life senior members, organized
two meetings this year, to which we
invited prestigious personalities in
the field to present the most interesting
results of their work. The first took
place online on 24 March 2021, with
Dr. Zvi Or-Bach the guest speaker. OrBach
is the founder and chief executive
officer (CEO) of MonolithIC 3D and a
world-recognized expert in monolithic
3D technologies. A past chairman
of the 3D component of the IEEE S3S
SOI-3D-Subthreshold Microelectronics
Technology Unified Conference, he is
active as an invited speaker and tutorial
instructor in the United States, Korea,
and Japan, and he is the author of
four monolithic 3D-related chapters
in NANO-CHIPS 2030: On-Chip AI for
an Efficient Data-Driven World and
one chapter in Chips 2020, Vol. 2: New
Vistas in Nanoelectronics.
Dr. Or-Bach.
At S3S 2017, OrBach
published a
paper, " A 1,000× Improvement
in Computer
Systems by Bridging
the Processor Memory
Gap, " that leveraged
innovative monolithic
3D integration while using existing
transistor and fabrication processes.
He chairs the Board for Zeno Semiconductors
and has a 20-year history of
innovative development of fast-turn
application-specific ICs (ASICs). His
vision led to the invention of the first
structured ASIC architecture, the first
single-via programmable array, and
the first laser-based system for oneday
gate array customization. Prior to
founding MonolithIC 3D, in 2009, OrBach
established eASIC, in 1999, and
served as its CEO for six years. That
company was funded by leading investors,
including Vinod Khosla and
Digital Object Identifier 10.1109/MSSC.2021.3110122
Date of current version: 17 November 2021
146
Kleiner Perkins, in three successive
rounds. Intel acquired it in 2018. Under
Or-Bach's leadership, eASIC won
the EE Times 2005 ACE Award for the
logic and programmable logic product
of the year. Or-Bach
received the EE Times
Innovator of the Year
Award, and he was
selected to be part of
the publication's " Disruptors-The
people,
Products, and Technologies
That Are
Changing the Way We
Live, Work, and Play. "
In approximatively
1 h, he presented his contributions
with " NuPGA-A New Type of Programmable
Fabric 3D FPGA: An FPGA
With ~ASIC Volume Production Cost. "
The event drew 24 IEEE attendees and
three from industry. A discussion period
followed the presentation.
The second event was also held
Or-Bach is the
founder and chief
executive officer
of MonolithIC
3D and a worldrecognized
expert
in monolithic 3D
technologies.
virtually, on 31 May, with Dr. Giacomo
Indiveri as the invited speaker. Indiveri
is a dual professor with the Faculty
of Science, University of Zurich, and
the Department of
Information Technology
and Electrical Engineering,
ETH Zurich.
He is the director of
the Institute of Neuroinformatics,
University
of Zurich and ETH
Zurich. An engineer by
training, Indiveri has
also expertise in neuroscience,
computer
science, and machine learning. He has
combined these disciplines by studying
natural and artificial intelligence
(AI) in neural processing systems
and neuromorphic cognitive agents.
His research interests lie in the study
of spike-based learning mechanisms
Dr. Or-Bach's presentation covers a new type of programmable fabric 3D field-programmable
gate array.
Dr. Or-Bach delivers his talk.
FALL 2021
IEEE SOLID-STATE CIRCUITS MAGAZINE
IEEE Solid-States Circuits Magazine - Fall 2021
Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Fall 2021
Contents
IEEE Solid-States Circuits Magazine - Fall 2021 - Cover1
IEEE Solid-States Circuits Magazine - Fall 2021 - Cover2
IEEE Solid-States Circuits Magazine - Fall 2021 - Contents
IEEE Solid-States Circuits Magazine - Fall 2021 - 2
IEEE Solid-States Circuits Magazine - Fall 2021 - 3
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IEEE Solid-States Circuits Magazine - Fall 2021 - Cover3
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