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About the Authors
Milin Zhang (zhangmilin@tsinghua.
edu.cn) received her B.S. and M.S. degrees
in electronic engineering from
Tsinghua University, Beijing, China,
in 2004 and 2006, respectively, and
her Ph.D. degree from the Electronic
and Computer Engineering Department,
The Hong Kong University of
Science and Technology, Hong Kong,
in 2010. She worked as a postdoctoral
researcher with the University of
Pennsylvania, Philadelphia, PA, USA,
after finishing her doctoral studies.
Since 2016, she has been an associate
professor with the Department
of Electronic Engineering, Tsinghua
University, Beijing 100084, China. Her
research interests include the designing
of various nontraditional imaging
sensors and biomedical sensing applications.
She received the Best Paper
Award of the Biomedical Circuits and
Systems Conference (BioCAS) Track of
the 2014 International Symposium on
Circuits and Systems (ISCAS), the Best
Paper Award (First Place) of the 2015
BioCAS, and the Best Student Paper
Award (Second Place) of ISCAS 2017.
She serves and has served as a Technical
Program Committee member for
ISSCC, the Custom Integrated Circuits
Conference, the Asian Solid-State Circuits
Conference, and BioCAS. She is
the chapter chair of the Solid-State
Circuits Society Beijing Chapter. She
is a Senior Member of IEEE.
Ziyao Zhao (zhaozy23@mails.tsinghua.
edu.cn) received his B.S. degree in
electronic engineering from Tsinghua
University, Beijing 100084, China, in
2023, where he is currently working
toward his Ph.D. degree. His current
research interests include low-power
algorithms and circuit designs for biomedical
applications.
Yuan Ma (mayuan19@mails.tsinghua.
edu.cn) received her B.S. degree in
electronic engineering from Tsinghua
University, Beijing 100084, China, in
2019, where she is currently working
toward her Ph.D. degree. Her current research
interests include low-power electrochemical
sensing interface circuits
and analog-to-digital converter circuits.
Chao Zhang (zc20@mails.tsing
hua.edu.cn) received his B.S. degree
in electronic engineering from Tsinghua
University, Beijing, China,
in 2020. He is currently working toward
his Ph.D. degree at Tsinghua
University, Beijing 100084, China,
focusing on ultralow-power EEGbased
BMI design. He has published
several articles in TCAS II and Advanced
Materials and conference papers
in the proceedings of ISCAS and
BioCAS, which include the topics of
EEG-based sleep staging, attention
evaluation, and signal completion.
He is a Student Member of IEEE.
Wei Song (sw17@mails.tsinghua.
edu.cn) received his B.S. degree in
electronic engineering from Tsinghua
University, Beijing, China, in 2017. He
is currently pursuing his Ph.D. degree
at Tsinghua University, Beijing
100084, China. His current research
interests include various kinds of
integrated circuit designs, such as
wireless neural interface transceivers
and low-power signal processing
algorithms. He is also interested in
electronic system designs, such as
BMIs. He is a Student Member of IEEE.
Jiaxin Lei (leijx19@mails.tsinghua.
edu.cn) received his B.S. degree in electronic
engineering from Tsinghua University,
Beijing 100084, China, in 2019,
where he is currently pursuing his Ph.D.
degree, focusing on low-power circuit
and system design. His research interests
include various low-power circuit and
system designs for biomedical applications.
He is a Student Member of IEEE.
Chao Xie (xc18@mails.tsinghua.
edu.cn) received his B.S. degree in
electronic science and technology
from the Huazhong University of Science
and Technology, Wuhan, China,
in 2018. He is currently pursuing his
Ph.D. degree at Tsinghua University,
Beijing 100084, China. His research
interests focus on piezoelectric energy-harvesting
systems and power
management circuits.
IEEE SOLID-STATE CIRCUITS MAGAZINE
FALL 2023
29
http://dx.doi.org/10.1109/TBCAS.2020.3038599
http://dx.doi.org/10.1109/TBCAS.2020.3038599
http://dx.doi.org/10.1109/JSSC.2022.3183174
http://dx.doi.org/10.1109/JSSC.2019.2961852
http://dx.doi.org/10.1109/JSSC.2019.2961852
http://dx.doi.org/10.1109/JSSC.2019.2894359
http://dx.doi.org/10.1109/ISSCC42615.2023.10067347
http://dx.doi.org/10.1038/s41551-017-0051
http://www.edu.cn
http://dx.doi.org/10.1515/ehs-2016-0028
http://dx.doi.org/10.1515/ehs-2016-0028
http://dx.doi.org/10.1016/j.ultras.2009.11.004
http://www.edu.cn
http://dx.doi.org/10.1109/TBCAS.2016.2583783
http://dx.doi.org/10.1109/JSSC.2017.2782086
http://dx.doi.org/10.1038/s41928-021-00592-y
IEEE Solid-States Circuits Magazine - Fall 2023
Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Fall 2023
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