IEEE Solid-States Circuits Magazine - Fall 2023 - 88

CONFERENCE REPORTS
2023 IEEE Symposium on VLSI Technology and Circuits
T
The 2023 IEEE Symposium on VLSI
Technology and Circuits (or simply
the VLSI Symposium) resumed in
Kyoto, Japan, for the first time since
2019, attracting an all-time symposium
record attendance of more than
1,600 and 93% onsite participation
(Figure 1)! The symposium was inaugurated
in 1981 with the initial vision
of fostering open technical exchanges
among researchers in Japan and the
United States as well as bridging the
divide between technologists and circuit
designers. Now in its 43rd consecutive
year of alternating venues
between Kyoto, Japan, and Honolulu,
Hawaii, the symposium has established
its reputation as the microelectronics
industry's premiere international conference,
uniquely offering even more
convergence in technology, circuits,
and systems topics-unlike any
other conference.
The VLSI Symposium took place
from Sunday, 11 June to Friday, 16 June
2023 at the RIHGA Royal Hotel Kyoto.
Unified by the theme of " Rebooting
Technology and Circuits for a SustainDigital
Object Identifier 10.1109/MSSC.2023.3315950
Date of current version: 14 November 2023
88
FIGURE 1: The VLSI Symposium resumed in Kyoto, Japan, as an in-person event.
FALL 2023
IEEE SOLID-STATE CIRCUITS MAGAZINE
able Future, " it featured advanced VLSI
technology developments,
innovative
circuit design, and the applications
they enable, such as artificial
intelligence (AI), machine learning,
the IoT, wearable/implantable
biomedical applications, big data,
cloud/edge computing, virtual and
augmented reality, robotics, and
autonomous vehicles. The symposium's
main offering comprised
two plenary sessions, 20 technology
sessions, 26 circuits sessions, and
five joint technology/circuits sessions.
Furthermore, the program
featured a demonstration session,
evening panel discussions, short
courses, workshops, and a forum
relevant to the symposium theme.
Virtual access to the technical content
became available the week following
the on-site event.
Plenary Sessions
The symposium launched the spirit
of collaboration between technology
and circuit innovators with four plenary
talks relevant to both camps.
In his talk, titled " Multi-Chiplet Heterogeneous
Integration Packaging
for Semiconductor System Scaling, "
Surya Bhattacharya from A*STAR
provided an overview of various
multichiplet heterogeneous integration
packaging platforms as a key
new toolbox to address system scaling
needs and diverse SiP requirements
across broad markets. Partha
Ranganathan from Google provided
a systems perspective in " A New

IEEE Solid-States Circuits Magazine - Fall 2023

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Contents
IEEE Solid-States Circuits Magazine - Fall 2023 - Cover1
IEEE Solid-States Circuits Magazine - Fall 2023 - Cover2
IEEE Solid-States Circuits Magazine - Fall 2023 - Contents
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IEEE Solid-States Circuits Magazine - Fall 2023 - Cover3
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