IEEE Solid-States Circuits Magazine - Spring 2020 - 103

IEEE N E WS

CEDA Currents

The following is a reprint from the
CEDA Currents, February 2020 issue,
a publication of the IEEE Council on
Electronic Design Automation (CEDA).
Please send contributions to Vasilis
Pavlidis (v.pavlidis @ieee.com).

ASAP 2020-Call for Contributions
The 31st IEEE International Conference on Application-Specific Systems,
Architectures (ASAP), and Processors
(https://asap2020.cs.manchester
.ac.uk/) will take place in Manchester, U.K., on 6-8 July 2020. The history of the ASAP conference traces
back to the International Workshop
on Systolic Arrays, organized in 1986
in Oxford, U.K. It later developed
into the International Conference
on Application-Specific Array Processors. With its current title, it was
organized for the first time in Chicago, Illinois, in 1996. Since then,
its location has alternated between
Europe and North America. The
conference covers the theory and
practice of application-specific systems, architectures, and processors.
For the 2020 edition of ASAP, manuscripts in the following categories
are especially welcome: Sustainable
computing, neuromorphic computing, and technologies beyond CMOS,
in addition to the traditional topical
research areas of the conference. Perspective authors are invited to submit original, unpublished research
papers through https://easychair
.org/conferences/?conf=asap2020
. Submission guidelines can be found
Digital Object Identifier 10.1109/MSSC.2020.2987242
Date of current version: 24 June 2020

at https://asap2020.cs.manchester
.ac.uk/cfp.html. The submission
deadlines for abstracts and full
papers are 27 March 2020 and 3 April
2020, respectively.

ICCAD CAD Contest 2020-Call
for Participation
The CAD Contest (http://iccad-contest
.org/2020/) at the International Conference on Computer-Aided Design
(ICCAD) is a challenging, multimonth,
research and development competition, focusing on advanced, real-world
problems in the field of electronic
design automation (EDA). It is open
to multiperson teams worldwide.
Each year, the organizing committee
announces three challenging problems in different topic areas, which
are provided by industrial companies. Contestants can participate in
one or more problems. The prizes will
be awarded at an ICCAD special session dedicated to this contest. Since
its inaugural year of 2012, the CAD

IEEE Embedded Systems Letters is open
for submissions. Visit http://ieee-ceda
.org/publication/esl-publication/author
-guidelines.
IEEE Design & Test is open for submissions. Visit https://ieee-ceda.org/
publication/ieee-design-test-dt/paper
-submission-instructions.

Contest at ICCAD has been attracting
more than 100 teams per year, fostering productive industry-academia collaborations and leading to hundreds
of publications in top-tier conferences
and journals. The contest undoubtedly boosts EDA research and continues to enhance its impact.

OPRECOMP Summer of Code
2020-Call for Proposals
The Open Transprecision Computing
project (OPRECOMP), supported by the
EU's H2020-FET proactive research
and innovation program, is looking to
support enthusiasts, researchers, and
students from EU member and associated countries of the H2020 program
who are working on open source projects on transprecision computing.
Submit your project proposals until
3 April 2020 through the OPRECOMP
Summer of Code website. Your proposals will be evaluated by a jury and
the 10 highest-ranked projects will
be supported with (up to) €6,000 per
accepted project.
Accepted proposals will be an--
nounced on 1 May 2020. Participants
will be expected to attend the OPRECOMP Summer School in Cagliari,
Italy, on 7-10 July 2020 to kick off
their projects. The results will be
presented at a final OPRECOMP workshop in February 2021. For more
information on how to be part of this
exciting event, please visit the OPRECOMP website, http://oprecomp.eu/
open-source/.

SVDTC Recent Activities
The IEEE System Validation and De--
bug Technology Committee (SVDTC) is

IEEE SOLID-STATE CIRCUITS MAGAZINE

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https://asap2020.cs.manchester.ac.uk/cfp.html https://asap2020.cs.manchester.ac.uk/cfp.html https://asap2020.cs.manchesterac.uk/ https://asap2020.cs.manchesterac.uk/ http://(http://iccad-contest.org/2020/ http://(http://iccad-contest.org/2020/ https://ieee-ceda.org/publication/esl-publication/author-guidelines https://ieee-ceda.org/publication/esl-publication/author-guidelines https://ieee-ceda.org/publication/esl-publication/author-guidelines https://easychair.org/account/signin?l=hkLuVJwz9uS9hxz0ylu4hU# http://oprecomp.eu/open-source/ http://oprecomp.eu/open-source/ https://easychair.org/account/signin?l=hkLuVJwz9uS9hxz0ylu4hU# https://ieee-ceda.org/publication/ieee-design-test-dt/paper-submission-instructions https://easychair.org/account/signin?l=hkLuVJwz9uS9hxz0ylu4hU# https://ieee-ceda.org/publication/ieee-design-test-dt/paper-submission-instructions https://ieee-ceda.org/publication/ieee-design-test-dt/paper-submission-instructions

IEEE Solid-States Circuits Magazine - Spring 2020

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2020