IEEE Solid-States Circuits Magazine - Spring 2020 - 46

of power-efficient neurostimulator
circuits and switched-capacitor dc-
dc converters for energy-harvesting
applications. He is a Student Member
of the IEEE.
Ronaldo Martins da Ponte (r.martins​
daponte@tudelft.nl) received his M.Sc.
degree from the Federal University of
Santa Catarina, Florianópolis, Brazil, in
2015. He is currently working toward
his Ph.D. degree at the Section Bio--
electronics, Delft University of Technology, The Netherlands. His research
interests include the MEMS-CMOS integration for optogenetic brain interfaces and lab-on-CMOS devices. He is
a Student Member of the IEEE.
Tiago Costa (t.m.l.dacosta@tudelft.nl)
received his Ph.D. degree from the
Electrical and Computer Engineering
Department, Instituto Superior Técnico, Universidade de Lisboa, Portugal,
in 2014. From 2015 to September 2019,
he was a postdoctoral research scientist with the Bioelectronics Systems
Laboratory, Columbia University, New
York, where he worked on ultrasound
phased-array systems for noninvasive
nerve ultrasound stimulation. He is an
assistant professor of bioelectronics
at Delft University of Technology, The
Netherlands, where he is pursuing the
development of new devices for minimally invasive and highly targeted
interfaces to the nervous system for
the next generation of electroceuticals. He is a Member of the IEEE.
Virgilio Valente (v.valente@tudelft
.nl) received his B.Sc. degree (first
class honors) in electronic engineering in 2004 from the University of
York, United Kingdom; his M.Sc.
degree in biomedical engineering in 2006 from Aalborg University, Denmark; and his Ph.D. degree
in electronic and electrical engineering from University College London
(UCL) in 2011. From 2011 to 2017,
he held two postdoctoral positions
as a research associate in the Analog
and Biomedical Electronics Research
Group at UCL, during which, in 2015,
he also joined Tetrivis Ltd, United
Kingdom, as an IC design engineer. In
2017, he was a visiting scholar at the
Nano Lab, Tufts University, Medford,

46	

S P R I N G 2 0 2 0	

Massachusetts. Currently, he is a faculty research fellow in bioelectronics
in the Department of Microelectronics, Delft University of Technology,
The Netherlands. He is a member of
the Biomedical Circuits and Systems
Technical Committee of the IEEE Circuits and Systems Society and the
recipient of the 2017 Engineering and
Physical Sciences Research Council
Interdisciplinary Research Collaboration i-sense Mobility fellowship. He
served as track chair at the 2019 IEEE
Asia Pacific Conference on Circuits
and Systems, Bangkok, Thailand. He is
a Member of the IEEE.
Vasiliki Giagka (v.giagka@tudelft
.nl) received her M.Eng. degree in
electronic and computer engineering
from Aristotle University of Thessaloniki, Greece, in 2009 and her Ph.D.
degree from the Analogue and Biomedical Electronics Group, University
College London in 2014. She joined the
Implanted Devices Group, University
College London, as a research associate before joining the Bioelectronics
Group, Delft University of Technology,
The Netherlands, as an assistant professor in 2015. Since September 2018
she has also led the Technologies
for Bioelectronics group, Fraunhofer
Institute for Reliability and Microintegration IZM, Berlin. Between her
two affiliations, she is carrying out
research on the design and fabrication of active neural interfaces.
In particular, she is investigating
new approaches for neural stimulation and wireless power transfer, as
well as implant miniaturization and
microsystem integration, packaging,
and encapsulation to meet the challenges of bioelectronic medicines.
She is a Member of the IEEE.
Wouter A. Serdijn (serdijn@ieee
.org) received his M.Sc. (cum laude)
and Ph.D. degrees from Delft University of Technology, The Netherlands,
in 1989 and 1994, respectively. He is a
full professor of bioelectronics at Delft
University of Technology, where he
heads the bioelectronics section, and
a Medical-Delta honorary professor
at both Delft University and the Erasmus Medical Center, Rotterdam. His

IEEE SOLID-STATE CIRCUITS MAGAZINE	

research interests include integrated
biomedical circuits and systems for
biosignal conditioning and detection, neuroprosthetics, transcutaneous
wireless communication, and power
management and energy harvesting as applied in cardiac pacemakers,
cochlear implants, neurostimulators,
bioelectronic medicine, and electroceuticals. He is an IEEE Distinguished
Lecturer and a mentor of the IEEE. In
2016, he received the IEEE Circuits and
Systems Meritorious Service Award.
He is a Fellow of the IEEE.
Timothy G. Constandinou (t.const
andinou@imperial.ac.uk) received
his B.Eng. and Ph.D. degrees in electronic engineering in 2001 and 2005,
respectively, from Imperial College
London. He is a reader of neural microsystems within the Circuits and Systems
Group, Department of Electrical and
Electronic Engineering, and also the
deputy director of the Centre for BioInspired Technology at Imperial College London. His research interests
include neural microsystems, neural
prosthetics, brain-machine interfaces, implantable devices, and lowpower microelectronics. He serves on
the IEEE Circuits and Systems (CAS)
Society BioCAS and sensory systems
technical committees and the IEEE
Brain Initiative steering committee. He
was the technical program cochair of
the 2010, 2011, and 2018 IEEE BioCAS
conferences and the general chair of
the BrainCAS 2016 and NeuroCAS 2018
workshops. He is the associate editorin-chief of IEEE Transactions on Biomedical Circuits and Systems. He is a
fellow of the Institution of Engineering
and Technology, a chartered engineer,
and a member of the Institute of Physics. He is a Senior Member of the IEEE.
Timothy Denison (timothy.denison
@eng.ox.ac.uk) is a professor in the
Department of Engineering Science,
University of Oxford, United Kingdom, where he explores bioelectronics. Prior to joining Oxford in 2018, he
was a technical fellow at Medtronic
PLC, where he worked on deep brain
stimulation devices and research
systems. He is a Senior Member of
the IEEE.



IEEE Solid-States Circuits Magazine - Spring 2020

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2020

Contents
IEEE Solid-States Circuits Magazine - Spring 2020 - Cover1
IEEE Solid-States Circuits Magazine - Spring 2020 - Cover2
IEEE Solid-States Circuits Magazine - Spring 2020 - Contents
IEEE Solid-States Circuits Magazine - Spring 2020 - 2
IEEE Solid-States Circuits Magazine - Spring 2020 - 3
IEEE Solid-States Circuits Magazine - Spring 2020 - 4
IEEE Solid-States Circuits Magazine - Spring 2020 - 5
IEEE Solid-States Circuits Magazine - Spring 2020 - 6
IEEE Solid-States Circuits Magazine - Spring 2020 - 7
IEEE Solid-States Circuits Magazine - Spring 2020 - 8
IEEE Solid-States Circuits Magazine - Spring 2020 - 9
IEEE Solid-States Circuits Magazine - Spring 2020 - 10
IEEE Solid-States Circuits Magazine - Spring 2020 - 11
IEEE Solid-States Circuits Magazine - Spring 2020 - 12
IEEE Solid-States Circuits Magazine - Spring 2020 - 13
IEEE Solid-States Circuits Magazine - Spring 2020 - 14
IEEE Solid-States Circuits Magazine - Spring 2020 - 15
IEEE Solid-States Circuits Magazine - Spring 2020 - 16
IEEE Solid-States Circuits Magazine - Spring 2020 - 17
IEEE Solid-States Circuits Magazine - Spring 2020 - 18
IEEE Solid-States Circuits Magazine - Spring 2020 - 19
IEEE Solid-States Circuits Magazine - Spring 2020 - 20
IEEE Solid-States Circuits Magazine - Spring 2020 - 21
IEEE Solid-States Circuits Magazine - Spring 2020 - 22
IEEE Solid-States Circuits Magazine - Spring 2020 - 23
IEEE Solid-States Circuits Magazine - Spring 2020 - 24
IEEE Solid-States Circuits Magazine - Spring 2020 - 25
IEEE Solid-States Circuits Magazine - Spring 2020 - 26
IEEE Solid-States Circuits Magazine - Spring 2020 - 27
IEEE Solid-States Circuits Magazine - Spring 2020 - 28
IEEE Solid-States Circuits Magazine - Spring 2020 - 29
IEEE Solid-States Circuits Magazine - Spring 2020 - 30
IEEE Solid-States Circuits Magazine - Spring 2020 - 31
IEEE Solid-States Circuits Magazine - Spring 2020 - 32
IEEE Solid-States Circuits Magazine - Spring 2020 - 33
IEEE Solid-States Circuits Magazine - Spring 2020 - 34
IEEE Solid-States Circuits Magazine - Spring 2020 - 35
IEEE Solid-States Circuits Magazine - Spring 2020 - 36
IEEE Solid-States Circuits Magazine - Spring 2020 - 37
IEEE Solid-States Circuits Magazine - Spring 2020 - 38
IEEE Solid-States Circuits Magazine - Spring 2020 - 39
IEEE Solid-States Circuits Magazine - Spring 2020 - 40
IEEE Solid-States Circuits Magazine - Spring 2020 - 41
IEEE Solid-States Circuits Magazine - Spring 2020 - 42
IEEE Solid-States Circuits Magazine - Spring 2020 - 43
IEEE Solid-States Circuits Magazine - Spring 2020 - 44
IEEE Solid-States Circuits Magazine - Spring 2020 - 45
IEEE Solid-States Circuits Magazine - Spring 2020 - 46
IEEE Solid-States Circuits Magazine - Spring 2020 - 47
IEEE Solid-States Circuits Magazine - Spring 2020 - 48
IEEE Solid-States Circuits Magazine - Spring 2020 - 49
IEEE Solid-States Circuits Magazine - Spring 2020 - 50
IEEE Solid-States Circuits Magazine - Spring 2020 - 51
IEEE Solid-States Circuits Magazine - Spring 2020 - 52
IEEE Solid-States Circuits Magazine - Spring 2020 - 53
IEEE Solid-States Circuits Magazine - Spring 2020 - 54
IEEE Solid-States Circuits Magazine - Spring 2020 - 55
IEEE Solid-States Circuits Magazine - Spring 2020 - 56
IEEE Solid-States Circuits Magazine - Spring 2020 - 57
IEEE Solid-States Circuits Magazine - Spring 2020 - 58
IEEE Solid-States Circuits Magazine - Spring 2020 - 59
IEEE Solid-States Circuits Magazine - Spring 2020 - 60
IEEE Solid-States Circuits Magazine - Spring 2020 - 61
IEEE Solid-States Circuits Magazine - Spring 2020 - 62
IEEE Solid-States Circuits Magazine - Spring 2020 - 63
IEEE Solid-States Circuits Magazine - Spring 2020 - 64
IEEE Solid-States Circuits Magazine - Spring 2020 - 65
IEEE Solid-States Circuits Magazine - Spring 2020 - 66
IEEE Solid-States Circuits Magazine - Spring 2020 - 67
IEEE Solid-States Circuits Magazine - Spring 2020 - 68
IEEE Solid-States Circuits Magazine - Spring 2020 - 69
IEEE Solid-States Circuits Magazine - Spring 2020 - 70
IEEE Solid-States Circuits Magazine - Spring 2020 - 71
IEEE Solid-States Circuits Magazine - Spring 2020 - 72
IEEE Solid-States Circuits Magazine - Spring 2020 - 73
IEEE Solid-States Circuits Magazine - Spring 2020 - 74
IEEE Solid-States Circuits Magazine - Spring 2020 - 75
IEEE Solid-States Circuits Magazine - Spring 2020 - 76
IEEE Solid-States Circuits Magazine - Spring 2020 - 77
IEEE Solid-States Circuits Magazine - Spring 2020 - 78
IEEE Solid-States Circuits Magazine - Spring 2020 - 79
IEEE Solid-States Circuits Magazine - Spring 2020 - 80
IEEE Solid-States Circuits Magazine - Spring 2020 - 81
IEEE Solid-States Circuits Magazine - Spring 2020 - 82
IEEE Solid-States Circuits Magazine - Spring 2020 - 83
IEEE Solid-States Circuits Magazine - Spring 2020 - 84
IEEE Solid-States Circuits Magazine - Spring 2020 - 85
IEEE Solid-States Circuits Magazine - Spring 2020 - 86
IEEE Solid-States Circuits Magazine - Spring 2020 - 87
IEEE Solid-States Circuits Magazine - Spring 2020 - 88
IEEE Solid-States Circuits Magazine - Spring 2020 - 89
IEEE Solid-States Circuits Magazine - Spring 2020 - 90
IEEE Solid-States Circuits Magazine - Spring 2020 - 91
IEEE Solid-States Circuits Magazine - Spring 2020 - 92
IEEE Solid-States Circuits Magazine - Spring 2020 - 93
IEEE Solid-States Circuits Magazine - Spring 2020 - 94
IEEE Solid-States Circuits Magazine - Spring 2020 - 95
IEEE Solid-States Circuits Magazine - Spring 2020 - 96
IEEE Solid-States Circuits Magazine - Spring 2020 - 97
IEEE Solid-States Circuits Magazine - Spring 2020 - 98
IEEE Solid-States Circuits Magazine - Spring 2020 - 99
IEEE Solid-States Circuits Magazine - Spring 2020 - 100
IEEE Solid-States Circuits Magazine - Spring 2020 - 101
IEEE Solid-States Circuits Magazine - Spring 2020 - 102
IEEE Solid-States Circuits Magazine - Spring 2020 - 103
IEEE Solid-States Circuits Magazine - Spring 2020 - 104
IEEE Solid-States Circuits Magazine - Spring 2020 - 105
IEEE Solid-States Circuits Magazine - Spring 2020 - 106
IEEE Solid-States Circuits Magazine - Spring 2020 - 107
IEEE Solid-States Circuits Magazine - Spring 2020 - 108
IEEE Solid-States Circuits Magazine - Spring 2020 - 109
IEEE Solid-States Circuits Magazine - Spring 2020 - 110
IEEE Solid-States Circuits Magazine - Spring 2020 - 111
IEEE Solid-States Circuits Magazine - Spring 2020 - 112
IEEE Solid-States Circuits Magazine - Spring 2020 - 113
IEEE Solid-States Circuits Magazine - Spring 2020 - 114
IEEE Solid-States Circuits Magazine - Spring 2020 - 115
IEEE Solid-States Circuits Magazine - Spring 2020 - 116
IEEE Solid-States Circuits Magazine - Spring 2020 - 117
IEEE Solid-States Circuits Magazine - Spring 2020 - 118
IEEE Solid-States Circuits Magazine - Spring 2020 - 119
IEEE Solid-States Circuits Magazine - Spring 2020 - 120
IEEE Solid-States Circuits Magazine - Spring 2020 - Cover3
IEEE Solid-States Circuits Magazine - Spring 2020 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019winter
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018fall
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018spring
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018winter
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2014
https://www.nxtbookmedia.com