IEEE Solid-States Circuits Magazine - Spring 2021 - 72

CHAPTERS
P
IEEE EDS/SSCS Joint Chapter, Croatia Section,
Prof. Makoto Nagata from Kobe University,
Japan, gave an IEEE Solid-State
Circuits Society (SSCS) Distinguished
Lecture (DL) on IC chip packaging issues,
" IC Chip and Packaging Interactions
in Design for Signal Intensity (SI),
Power Integrity (PI), Electromagnetic
Compatibility (EMC), and Electrostatic
Discharge Protection (ESD). " Held on
25 February 2021, the seminar was
organized as a virtual event under
the auspices of Prof. Mirko Poljak and
Prof. Marko Koricˇic´, chairs of the joint
IEEE Electron Devices Society (EDS)/
SSCS Chapter, Croatia Section.
Nagata divided the seminar into
two parts. During the first part of
the lecture, he gave an overview of
power noise simulation and diagnosis
techniques. In the second part,
he discussed problems related to the
power noise and solutions for advanced
packaging.
Nagata showed how the interactions
of IC chips and packaging
structures differentiate the electronic
performance of power delivery networks
in traditional 2D and advanced
2.5D and 3D technologies. He then
discussed their impacts on SI, PI,
EMC, and ESD, through in-depth silicon
experiments with in-place noise
measurements and full-chip-level
noise simulations. Nagata reported
about the research achievements of
his group at Kobe University, which
included the latest results on their
test vehicles, which are given in traditional
2D face-up and flip-chip
packaging, 2.5D fan-out wafer-level
Digital Object Identifier 10.1109/MSSC.2021.3072178
Date of current version: 24 June 2021
72
The title slide (top) and several attendees (bottom) of Prof. Nagata's DL presentation.
SPRING 2021
IEEE SOLID-STATE CIRCUITS MAGAZINE
Hosts SSCS Distinguished Lecturer Prof. Makoto Nagata
packaging, and 3D chip stacking with
through-silicon vias.
There were about 30 attendees, including
almost the entire Croatia Section
Chapter membership, undergraduate
and graduate students, and university
professors and research staff from different
institutions in Croatia, e.g., the

IEEE Solid-States Circuits Magazine - Spring 2021

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