IEEE Solid-States Circuits Magazine - Spring 2022 - 107

■ Yingying Fan, Rice University
■ Archisman Ghosh, Purdue University
■ Jiang Gong, TU Delft
■ Han Hao, University of Pennsylvania
■ Yan He, Rice University
■ Shoubhik Karmakar, TU Delft
■ Juyeop Kim, Korea Advanced Institute
of Science and Technology
■ Keun-Mok Kim, Korea Advanced Institute
of Science and Technology
■ Changuk Lee, Yonsei University
■ Naga Sasikanth Mannem, Georgia
Institute of Technology
■ Inho Park, Korea University
■ Sujin Park, Korea Advanced Institute
of Science and Technology
■ Masoud Pashaeifar, TU Delft
■ Corentin Pochet, University of
California, San Diego
■ Junjun Qiu, Tokyo Institute of
Technology
■ Sam Razavian, University of California,
Los Angeles
■ Thije Rooijers, TU Delft
■ Hooman Saeidi, Princeton University
■ Dragan Simic, KU Leuven
■ Arian Hashemi Talkhooncheh,
California Institute of Technology
■ Thierry Tambe, Harvard University
■ Zhaowen Wang, Columbia University
■ Shanshan Xie, University of Texas
at Austin
■ Bingzheng Yang, University of
Electronic Science and Technology
of China
■ Joanne Tan Si Ying, University of
Singapore
■ Zhanghao Yu, Rice University.
More information about the Predoctoral
Achievement Award winners
can be found at https://sscs.ieee.org/
membership/awards/predoctoral
-achievement-award.
SSCS Student Travel Grant Award
The SSCS Student Travel Grant Award
(STGA) recognizes and promotes early
career accomplishments in all solidstate
circuits fields by supporting
student travel to SSCS-sponsored conferences.
Since the 2022 IEEE Solid-State
Circuits Conference was held virtually,
students were awarded free conference
registration. The following students
were selected:
■ Dhairya Arora, Birla Institute of
Technology and Science, Pilani
■ Baibhab Chatterjee, Purdue University
■
Xi Chen, University College Dublin
■ Xibi Chen, Massachusetts Institute
of Technology
■ Kyung-Sik Choi, Korea Advanced
Institute of Science and Technology
■ Saurbah Dhiman, Indian Institute
of Technology Mandi
■ Ava O. Dwyer, University College Cork
■ Muhammad Musab Farooq, University
of Texas at Dallas
■ Jia Yi Fong, National University of
Singapore
■ Xi Fu, Tokyo Institute of Technology
■ Jose Guajardo, University of California,
Berkeley
■ Jiaqi Guo, National University of
Singapore
■ Yi-Yen Hsieh, National Taiwan
University
■ Shimin Huang, Cornell University
■ Dongseok Im, Korea Advanced Institute
of Science and Technology
■ Vikram Jain, KU Leuven
■ Rafailia-Eleni Karamani, Democritus
University of Thrace
■ ZeinabAlsadat KashaniRavandi,
Pennsylvania State University
■ Muhammad Ibrahim Wasiq Khan,
Massachusetts Institute of Technology
■
Juyeop Kim, Korea Advanced Institute
of Science and Technology
■ Keun-Mok Kim, Korea Advanced Institute
of Science and Technology
■ Soyeon Kim, Korea Advanced Institute
of Science and Technology
■ Changuk Lee, Yonsei University
■ Zhiyong Li, Korea Advanced Institute
of Science and Technology
■ Zhuoyue Li, National University
of Singapore
■ Yu-Chi Lin, University of California,
Berkeley
■ Nathan Monroe, Massachusetts
Institute of Technology
■ Akhil Pakala, Rice University
■ Dilruba Parvin, University of Missouri
■
Sreeni Poolakkal, Washington
State University
■ Subhajit Ray, Columbia University
■ Sam Razavian, University of California,
Los Angeles
■ Arslan Riaz, Boston University
■ Michella Rustom, University of
Southern California
■ Uisub Shin, Cornell University
■ Salma Soliman, American University
in Cairo
■ Yuqi Su, Nanyang Technological
University
■ Jui-Hung Sun, University of Southern
California
■ Junyao Tang, Iowa State University
■ Tuna Berk Tufan, Worcester Polytechnic
Institute
■ Soyeon Um, Korea Advanced Institute
of Science and Technology
■ Madhan Venkatesh, University
College Cork
■ Anthony Wall, University College
Cork
■ Tzuhan Wang, Georgia Institute of
Technology
■ Zhongzheng Wang, University
College Cork
■ Jiajia Wu, University of California,
San Diego
■ Liuhao Wu, National University of
Singapore
■ Shanshan Xie, University of Texas
at Austin
■ Jinglong Xu, Korea Advanced Institute
of Science and Technology
■ Rongjin Xu, Fudan University
■ Dongwon You, Tokyo Institute of
Technology
■ Linran Zhao, University of Texas
at Austin
■ Timur Zirtiloglu, Boston University.
More information about the STGA
winners can be found at https://
sscs.ieee.org/membership/awards/
student-travel-grants.
IEEE SOLID-STATE CIRCUITS MAGAZINE
SPRING 2022
107
https://sscs.ieee.org/membership/awards/predoctoral-achievement-award https://sscs.ieee.org/membership/awards/predoctoral-achievement-award https://sscs.ieee.org/membership/awards/predoctoral-achievement-award https://sscs.ieee.org/membership/awards/student-travel-grants https://sscs.ieee.org/membership/awards/student-travel-grants https://sscs.ieee.org/membership/awards/student-travel-grants

IEEE Solid-States Circuits Magazine - Spring 2022

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2022

Contents
IEEE Solid-States Circuits Magazine - Spring 2022 - Cover1
IEEE Solid-States Circuits Magazine - Spring 2022 - Cover2
IEEE Solid-States Circuits Magazine - Spring 2022 - Contents
IEEE Solid-States Circuits Magazine - Spring 2022 - 2
IEEE Solid-States Circuits Magazine - Spring 2022 - 3
IEEE Solid-States Circuits Magazine - Spring 2022 - 4
IEEE Solid-States Circuits Magazine - Spring 2022 - 5
IEEE Solid-States Circuits Magazine - Spring 2022 - 6
IEEE Solid-States Circuits Magazine - Spring 2022 - 7
IEEE Solid-States Circuits Magazine - Spring 2022 - 8
IEEE Solid-States Circuits Magazine - Spring 2022 - 9
IEEE Solid-States Circuits Magazine - Spring 2022 - 10
IEEE Solid-States Circuits Magazine - Spring 2022 - 11
IEEE Solid-States Circuits Magazine - Spring 2022 - 12
IEEE Solid-States Circuits Magazine - Spring 2022 - 13
IEEE Solid-States Circuits Magazine - Spring 2022 - 14
IEEE Solid-States Circuits Magazine - Spring 2022 - 15
IEEE Solid-States Circuits Magazine - Spring 2022 - 16
IEEE Solid-States Circuits Magazine - Spring 2022 - 17
IEEE Solid-States Circuits Magazine - Spring 2022 - 18
IEEE Solid-States Circuits Magazine - Spring 2022 - 19
IEEE Solid-States Circuits Magazine - Spring 2022 - 20
IEEE Solid-States Circuits Magazine - Spring 2022 - 21
IEEE Solid-States Circuits Magazine - Spring 2022 - 22
IEEE Solid-States Circuits Magazine - Spring 2022 - 23
IEEE Solid-States Circuits Magazine - Spring 2022 - 24
IEEE Solid-States Circuits Magazine - Spring 2022 - 25
IEEE Solid-States Circuits Magazine - Spring 2022 - 26
IEEE Solid-States Circuits Magazine - Spring 2022 - 27
IEEE Solid-States Circuits Magazine - Spring 2022 - 28
IEEE Solid-States Circuits Magazine - Spring 2022 - 29
IEEE Solid-States Circuits Magazine - Spring 2022 - 30
IEEE Solid-States Circuits Magazine - Spring 2022 - 31
IEEE Solid-States Circuits Magazine - Spring 2022 - 32
IEEE Solid-States Circuits Magazine - Spring 2022 - 33
IEEE Solid-States Circuits Magazine - Spring 2022 - 34
IEEE Solid-States Circuits Magazine - Spring 2022 - 35
IEEE Solid-States Circuits Magazine - Spring 2022 - 36
IEEE Solid-States Circuits Magazine - Spring 2022 - 37
IEEE Solid-States Circuits Magazine - Spring 2022 - 38
IEEE Solid-States Circuits Magazine - Spring 2022 - 39
IEEE Solid-States Circuits Magazine - Spring 2022 - 40
IEEE Solid-States Circuits Magazine - Spring 2022 - 41
IEEE Solid-States Circuits Magazine - Spring 2022 - 42
IEEE Solid-States Circuits Magazine - Spring 2022 - 43
IEEE Solid-States Circuits Magazine - Spring 2022 - 44
IEEE Solid-States Circuits Magazine - Spring 2022 - 45
IEEE Solid-States Circuits Magazine - Spring 2022 - 46
IEEE Solid-States Circuits Magazine - Spring 2022 - 47
IEEE Solid-States Circuits Magazine - Spring 2022 - 48
IEEE Solid-States Circuits Magazine - Spring 2022 - 49
IEEE Solid-States Circuits Magazine - Spring 2022 - 50
IEEE Solid-States Circuits Magazine - Spring 2022 - 51
IEEE Solid-States Circuits Magazine - Spring 2022 - 52
IEEE Solid-States Circuits Magazine - Spring 2022 - 53
IEEE Solid-States Circuits Magazine - Spring 2022 - 54
IEEE Solid-States Circuits Magazine - Spring 2022 - 55
IEEE Solid-States Circuits Magazine - Spring 2022 - 56
IEEE Solid-States Circuits Magazine - Spring 2022 - 57
IEEE Solid-States Circuits Magazine - Spring 2022 - 58
IEEE Solid-States Circuits Magazine - Spring 2022 - 59
IEEE Solid-States Circuits Magazine - Spring 2022 - 60
IEEE Solid-States Circuits Magazine - Spring 2022 - 61
IEEE Solid-States Circuits Magazine - Spring 2022 - 62
IEEE Solid-States Circuits Magazine - Spring 2022 - 63
IEEE Solid-States Circuits Magazine - Spring 2022 - 64
IEEE Solid-States Circuits Magazine - Spring 2022 - 65
IEEE Solid-States Circuits Magazine - Spring 2022 - 66
IEEE Solid-States Circuits Magazine - Spring 2022 - 67
IEEE Solid-States Circuits Magazine - Spring 2022 - 68
IEEE Solid-States Circuits Magazine - Spring 2022 - 69
IEEE Solid-States Circuits Magazine - Spring 2022 - 70
IEEE Solid-States Circuits Magazine - Spring 2022 - 71
IEEE Solid-States Circuits Magazine - Spring 2022 - 72
IEEE Solid-States Circuits Magazine - Spring 2022 - 73
IEEE Solid-States Circuits Magazine - Spring 2022 - 74
IEEE Solid-States Circuits Magazine - Spring 2022 - 75
IEEE Solid-States Circuits Magazine - Spring 2022 - 76
IEEE Solid-States Circuits Magazine - Spring 2022 - 77
IEEE Solid-States Circuits Magazine - Spring 2022 - 78
IEEE Solid-States Circuits Magazine - Spring 2022 - 79
IEEE Solid-States Circuits Magazine - Spring 2022 - 80
IEEE Solid-States Circuits Magazine - Spring 2022 - 81
IEEE Solid-States Circuits Magazine - Spring 2022 - 82
IEEE Solid-States Circuits Magazine - Spring 2022 - 83
IEEE Solid-States Circuits Magazine - Spring 2022 - 84
IEEE Solid-States Circuits Magazine - Spring 2022 - 85
IEEE Solid-States Circuits Magazine - Spring 2022 - 86
IEEE Solid-States Circuits Magazine - Spring 2022 - 87
IEEE Solid-States Circuits Magazine - Spring 2022 - 88
IEEE Solid-States Circuits Magazine - Spring 2022 - 89
IEEE Solid-States Circuits Magazine - Spring 2022 - 90
IEEE Solid-States Circuits Magazine - Spring 2022 - 91
IEEE Solid-States Circuits Magazine - Spring 2022 - 92
IEEE Solid-States Circuits Magazine - Spring 2022 - 93
IEEE Solid-States Circuits Magazine - Spring 2022 - 94
IEEE Solid-States Circuits Magazine - Spring 2022 - 95
IEEE Solid-States Circuits Magazine - Spring 2022 - 96
IEEE Solid-States Circuits Magazine - Spring 2022 - 97
IEEE Solid-States Circuits Magazine - Spring 2022 - 98
IEEE Solid-States Circuits Magazine - Spring 2022 - 99
IEEE Solid-States Circuits Magazine - Spring 2022 - 100
IEEE Solid-States Circuits Magazine - Spring 2022 - 101
IEEE Solid-States Circuits Magazine - Spring 2022 - 102
IEEE Solid-States Circuits Magazine - Spring 2022 - 103
IEEE Solid-States Circuits Magazine - Spring 2022 - 104
IEEE Solid-States Circuits Magazine - Spring 2022 - 105
IEEE Solid-States Circuits Magazine - Spring 2022 - 106
IEEE Solid-States Circuits Magazine - Spring 2022 - 107
IEEE Solid-States Circuits Magazine - Spring 2022 - 108
IEEE Solid-States Circuits Magazine - Spring 2022 - 109
IEEE Solid-States Circuits Magazine - Spring 2022 - 110
IEEE Solid-States Circuits Magazine - Spring 2022 - 111
IEEE Solid-States Circuits Magazine - Spring 2022 - 112
IEEE Solid-States Circuits Magazine - Spring 2022 - 113
IEEE Solid-States Circuits Magazine - Spring 2022 - 114
IEEE Solid-States Circuits Magazine - Spring 2022 - 115
IEEE Solid-States Circuits Magazine - Spring 2022 - 116
IEEE Solid-States Circuits Magazine - Spring 2022 - 117
IEEE Solid-States Circuits Magazine - Spring 2022 - 118
IEEE Solid-States Circuits Magazine - Spring 2022 - 119
IEEE Solid-States Circuits Magazine - Spring 2022 - 120
IEEE Solid-States Circuits Magazine - Spring 2022 - Cover3
IEEE Solid-States Circuits Magazine - Spring 2022 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019winter
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018fall
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018spring
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018winter
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2014
https://www.nxtbookmedia.com