IEEE Solid-States Circuits Magazine - Spring 2022 - 36

Mahmoud Reza Ahmadi and Canruo Ying
The Evolution of
Automotive Interconnect
and Physical-Layer
Technologies
Ubiquitous pathways enabling intelligent vehicles
Digital Object Identifier 10.1109/MSSC.2022.3161257
Date of current version: 25 June 2022
36
SPRING 2022
IEEE SOLID-STATE CIRCUITS MAGAZINE
1943-0582/22©2022IEEE

IEEE Solid-States Circuits Magazine - Spring 2022

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2022

Contents
IEEE Solid-States Circuits Magazine - Spring 2022 - Cover1
IEEE Solid-States Circuits Magazine - Spring 2022 - Cover2
IEEE Solid-States Circuits Magazine - Spring 2022 - Contents
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IEEE Solid-States Circuits Magazine - Spring 2022 - Cover3
IEEE Solid-States Circuits Magazine - Spring 2022 - Cover4
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