IEEE Solid-States Circuits Magazine - Spring 2023 - 170

xpl/conhome/9947060/proceeding).
The 44 sessions were organized to
keep consistency with the different
tracks to which the contributions were
submitted. Specifically, there were
seven ESSCIRC tracks focused on different
aspects of circuit design (Analog
Circuits, Data Converters, RF and Millimeter-Wave
Circuits, Frequency Generation,
Digital Circuits and Systems,
Power Management, and Wireless and
Wireline Circuits and Systems); three
ESSDERC tracks (Advanced Technology,
Process and Materials; Analog,
Power and RF Devices; and Compact
Modeling and Process/Device Simulation)
as well as three joint tracks that
welcomed contributions in which device-
and circuit-level aspects merged
in tackling relevant and hot topics
(Emerging Computing Devices and
Circuits, Memory Devices and Circuits
Toward non-von Neumann, and Devices
and Circuits for Sensors, Optoelectronics,
and Display).
In addition to the technical sessions,
the conference hosted several
noteworthy events. At the end of the
tutorials and workshops, the conference
hosted a panel discussion on
the contributions of the local area
(i.e., Lombardy) to the field of microelectronics
and related growth perspectives.
The discussion, hosted by
Andrea Lacaita (Polytechnic of Milan,
Italy), started with a welcoming
speech by Giovanna Iannantuoni (Rector,
University of Milan-Bicocca) and
Fabrizio Sala (Lombardy region council
member for education, university,
research, innovation, and simplification,
Italy) and saw the participation
of Francesco Svelto (Rector, University
of Pavia, Italy), Giuliano Busetto (Digital
Industries CEO, Siemens SpA, and
past president of Federazione ANIE,
Italy), Renato Lombardi (Huawei fellow
and president of Huawei Italy
Research Center), Alessandro Matera
(CEO of Infineon Technologies, Italy),
and Giuseppe Notarnicola (president
of STMicroelectronics Italy). The event
featured fruitful and lively discussions
promoted also by the presence
in the audience of a significant number
of young students and technical
staff members from several compa170
SPRING 2023
FIGURE 4: The gala dinner at the Museo Nazionale della Scienza e della Tecnologia Leonardo
da Vinci with a view of the hull of the Luna Rossa racing boat suspended from the ceiling.
nies. The following day, a mentoring
event took place at a lunch organized
by the IEEE Young Professionals and
Women in Engineering and cosponsored
by the EDS and the SSCS. The
event saw a significant presence of
young Ph.D. students, postdocs, and
early stage professionals-especially
women-who had the chance to connect
with SSCS and EDS executives and
luminaries in the field, while having an
informal lunch break. Another notable
event was held two days later: a panel
discussion on the European Union (EU)
Chips Act. In this event, high representatives
of the EU Commission, industry,
and academia discussed the
expected actions and impact of the act
as a response by the EU Commission
and Member States to the current scenario,
which, due to the recent health
and supply crisis, demonstrated the
importance of the semiconductor sector
for EU societal needs and industrial
base. The discussion, moderated
by Joachim Burghartz (director of the
Institute for Microelectronics Stuttgart
IMS CHIPS, Germany), was participated
in by Alessandro Aresu (member
of European Semiconductor Expert
Group, Italy), Sabine Herlitschka (CEO,
Infineon Technologies, Austria), Carlo
Reita (CEA-Leti, Director Strategic Partnerships
and Planning, France), Enrico
Sangiorgi (University of Bologna, Italian
Research Ministry, coordinator of
the technical board for the study regarding
next-generation semiconducIEEE
SOLID-STATE CIRCUITS MAGAZINE
tor technologies, Italy - Sinano Institute),
and Lucilla Sioli (European Commission,
director for Artificial Intelligence
and Digital Industry).
The conference also included an
intriguing social program. The welcome
reception took place at the
iconic Castello Sforzesco, one of the
largest castles in Europe (Figure 3),
and included the possibility of a guided
visit to Michelangelo's Pietà Rondanini
and to the merlate (battlements)
for all attendees. The gala dinner took
place at the Museo Nazionale della
Scienza e della Tecnologia Leonardo
da Vinci, one of the largest science
and technology museums in Europe,
nestled in the cloisters of a Renaissance
monastery. The event offered
the possibility of dining with the view
of the hull of the Luna Rossa racing
boat suspended from the ceiling and
saw the artistic contribution of singers
and musicians from the La Scala
theater in Milan (Figure 4).
In summary, ESSDERC-ESSCIRC
2022 was an inspiring event with ample
participation and a rich and stimulating
program. The ESSDERC-ESSCIRC
community is looking forward to another
exciting edition in Lisbon, Portugal,
11-14 September 2023.
-Piero Malcovati
Francesco Maria Puglisi
Davide Giacomini,
and Andrea Baschirotto
,
Davide Pandini,
,
https://orcid.org/0000-0001-6514-9672 https://orcid.org/0000-0001-6178-2614 https://orcid.org/0000-0002-8844-5754

IEEE Solid-States Circuits Magazine - Spring 2023

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2023

Contents
IEEE Solid-States Circuits Magazine - Spring 2023 - Cover1
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