IEEE Solid-States Circuits Magazine - Spring 2023 - 40

Dec. 2011, doi: 10.1109/TBCAS.2011.
2158431.
[3] D. Karolak et al., " Design comparison of
low-power rectifiers dedicated to RF energy
harvesting, " in Proc. 19th IEEE Int. Conf.
Electron., Circuits, Syst. (ICECS), 2012,
pp. 524-527, doi: 10.1109/ICECS.2012.
6463693.
[4] K. Kotani, A. Sasaki, and T. Ito, " High-efficiency
differential-drive CMOS rectifier
for UHF RFIDs, " IEEE J. Solid-State Circuits,
vol. 44, no. 11, pp. 3011-3018, Nov. 2009,
doi: 10.1109/JSSC.2009.2028955.
[5] M. S. Steyaert and W. M. Sansen, " Power
supply rejection ratio in operational transconductance
amplifiers, " IEEE Trans. Circuits
Syst., vol. 37, no. 9, pp. 1077-1084,
Sep. 1990, doi: 10.1109/31.57596.
[6] E. Fernández et al., " Visual percepts evoked
with an intracortical 96-channel microelectrode
array inserted in human occipital
cortex, " J. Clin. Investigation, vol.
131, no. 23, Dec. 2021, Art. no. e151331,
doi: 10.1172/JCI151331.
[7] T. Callier et al., " Long-term stability of sensitivity
to intracortical microstimulation
of somatosensory cortex, " J. Neural Eng.,
vol. 12, no. 5, Oct. 2015, Art. no. 056010,
doi: 10.1088/1741-2560/12/5/056010.
[8] E. Noorsal et al., " A neural stimulator frontend
with high-voltage compliance and
programmable pulse shape for epiretinal
implants, " IEEE J. Solid-State Circuits,
vol. 47, no. 1, pp. 244-256, Jan. 2012, doi:
10.1109/JSSC.2011.2164667.
[9] A. Khalifa et al., " The microbead: A 0.009
mm3 implantable wireless neural stimulator, "
IEEE Trans. Biomed. Circuits Syst.,
vol. 13, no. 5, pp. 971-985, Oct. 2019, doi:
10.1109/TBCAS.2019.2939014.
[10] J. Lee et al., " Neural recording and stimulation
using wireless networks of microimplants, "
Nature Electron., vol. 4, no.
8, pp. 604-614, Aug. 2021, doi: 10.1038/
s41928-021-00631-8.
[11] M. Zaeimbashi et al., " Ultra-compact
dual-band smart NEMS magnetoelectric
antennas for simultaneous wireless energy
harvesting and magnetic field sensing, "
Nature Commun., vol. 12, no. 1, pp.
1-11, May 2021, doi: 10.1038/s41467-02123256-z.
About
the Authors
Gian Luca Barbruni was born in Sanremo
(IM), Italy in 1995. He received
his B.Sc. degree (2017) and M.Sc. degree
(2019) in biomedical engineering
from the Politecnico di Torino,
Italy. He was a research associate at
the Department of Electronics and
Telecommunications and MiNES
(Micro&Nano Electronic Systems)
laboratory at Politecnico di Torino.
Currently, he is conducting his Ph.D.
in microsystems and microelectronics
at the Bio/CMOS Interfaces Laboratory,
École Polytechnique Fédérale
de Lausanne, 2000 Neuchâtel, Switzerland,
and the Medtronic Chair in
Neuroengineering, École Polytechnique
Fédérale de Lausanne, 1015
Geneve, Switzerland. He is working
on the development and validation of
an innovative miniaturized and wireless
neuroprosthesis for artificial
vision. His current research interests
include wireless power transfer
and data communication, biomedical
CMOS design, neural prostheses,
nanobiosensors, and ultra-low-power
and miniaturized integrated circuits
for the development of innovative
biomedical systems.
Diego Ghezzi holds the Medtronic
Chair in Neuroengineering at the
School of Engineering, École Polytechnique
Fédérale de Lausanne,
1015 Geneve, Switzerland. He received
his M.Sc. degree in biomedical
engineering (2004) and his Ph.D.
degree in bioengineering (2008)
from the Politecnico di Milano. From
2008 to 2013, he completed his postdoctoral
training at the Istituto Italiano
di Tecnologia in Genova at the
Department of Neuroscience and
Brain Technologies, where he was
promoted to researcher in 2013. In
2015, he was appointed as a tenuretrack
assistant professor of bioengineering
at the EPFL Center for
Neuroprosthetics and Institute of
Bioengineering. His laboratory is a
multidisciplinary environment promoting
cross-fertilization among
diverse expertise. He brings materials
science, engineering, computer
science, life science, and medicine
together through the convergence
of physicists, engineers, neuroscientists,
and ophthalmologists cooperating
to accomplish innovative
projects. His mission is to develop
and implement application-driven
solutions based on compliant,
minimally invasive, and replaceable
neurotechnology for artificial
vision and other neurological disorders.
Ultimately, he aims at translating
our research findings into
clinical practice.
Sandro Carrara is an IEEE Fellow
and also the recipient of the IEEE
Sensors Council Technical Achievement
Award. He is the recipient of
the IEEE Sensors Council Technical
Achievement Award. He is a Faculty
with the Bio/CMOS Interfaces
Laboratory, École Polytechnique Fédérale
de Lausanne, 2000 Neuchâtel,
Switzerland, and a former professor
at the Universities of Genoa and
Bologna (Italy). He holds a Ph.D.
in biochemistry and biophysics, a
master's degree in physics, and a
diploma in electronics. His scientific
interests are in the electrical
phenomena of nano-bio-structured
films and include the CMOS design
of biochips based on proteins and
DNA. Throughout his career, he has
published seven books, one as the
author in 2013 with Springer on Bio/
CMOS interfaces and, more recently,
a Handbook of Bioelectronics with
Cambridge University Press. He has
more than 360 publications and 17
patents. He is now the editor-inchief
of IEEE Sensors Journal, founder
and editor-in-chief of the journal
BioNanoScience by Springer, and associate
editor of IEEE Transactions
on Biomedical Circuits and Systems.
He is a member of the IEEE Sensors
Council and a member of the Board
of Governors of the IEEE CAS Society.
He has been appointed two times as
an IEEE Distinguished Lecturer. His
work received several international
recognitions as best-cited papers
and best conference papers. He has
been the general chairman of the
conference IEEE BioCAS 2014 and general
cochair of the conferences IEEE
MeMeA2018 and PRIME 2019. He is the
recipient of the IEEE Sensors Council
Technical Achievement Award.
40
SPRING 2023
IEEE SOLID-STATE CIRCUITS MAGAZINE

http://dx.doi.org/10.1109/TBCAS.2011.2158431 http://dx.doi.org/10.1109/TBCAS.2011.2158431 http://dx.doi.org/10.1109/JSSC.2009.2028955 http://dx.doi.org/10.1109/31.57596 http://dx.doi.org/10.1088/1741-2560/12/5/056010 http://dx.doi.org/10.1109/JSSC.2011.2164667 http://dx.doi.org/10.1109/TBCAS.2019.2939014 http://dx.doi.org/10.1038/s41928-021-00631-8 http://dx.doi.org/10.1038/s41928-021-00631-8 http://dx.doi.org/10.1038/s41467-021-23256-z http://dx.doi.org/10.1038/s41467-021-23256-z

IEEE Solid-States Circuits Magazine - Spring 2023

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Spring 2023