IEEE Solid-States Circuits Magazine - Summer 2019 - 108

Find us online at http://ieee-ceda.org.

and artificial intelligence developed
by Amazon (including CPUs, graphics
processing units, field-programmable
gate arrays, and other emerging acceleration technologies), coupled with
smart, cloud-connected devices to create next-generation intelligent products
for Amazon customers. The talk concluded with examples of how cloudbased semiconductor design is being
enhanced using these same methods.
The luncheon was very well received by the DATE audience, with
more than 150 attendees filling the
room. Many in the audience complimented the speech. CEDA showed with
this luncheon its strong support of
key conferences related to electronic
design automation and embedded systems. The luncheon also demonstrated
CEDA's interest in building bridges
between the embedded and highperformance computing/data center communities.

CEDA President Visits
Morocco Chapter
As a way to promote CEDA activities
for young professionals and students,
the Morocco CEDA Chapter held a
number of DLP talks during CEDA
President Prof. David Atienza's visit
to Marrakech, Safi, and Casablanca
in April. For this series of DLP talks,
Prof. Atienza had the opportunity to
interact with young researchers and
engineers and explain how they can
join and participate in IEEE CEDA activities as IEEE Student Members.
In addition, at the École Nationale
des Sciences Appliquées (ÉNSA) in Marrakech and Safi, Prof. Atienza gave two
DLP talks about the latest trends in IoT
technologies. ÉNSA is part of the main
national public engineering school
in Morocco. During the visits to both
schools, Prof. Atienza had the opportu-

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SU M M E R 2 0 19

nity to meet with the two ÉNSA directors to promote stronger cooperation
of IEEE CEDA with high-level education centers in Morocco in all aspects
related to electrical engineering and
computer science, electronic design
automation, and embedded systems
design. Discussions took place about
organizing a number of CEDA DLP
seminars and workshops in Morocco
in the next two years (which would
include IEEE CEDA members) as part
of the growing number of professional
education activities for engineers in
the IoT space that the Morocco CEDA
Chapter is developing as the main hub
of CEDA in Africa.

IEEE COUNCIL ON ELECTRONIC
DESIGN AUTOMATION
President: David Atienza
President-Elect: Yao-Wen Chang
Past President: Shishpal Rawat
Secretary: Agnieszka Dubaj
VP Conferences: Luca Fanucci
VP Finance: Cristiana Bolchini
VP Publications: L. Miguel Silveira
VP Publicity: Vasilis Pavlidis
VP Standards: Dennis Brophy
VP Activities: Gi-Joon Nam
VP Awards: Subhasish Mitra
VP Initiatives: Jose Ayala
Council Operations Manager:
Jennifir McGillis

IEEE Transactions on CAD Special
Issue-Call for Papers
IEEE Transactions on Computer-Aided
Design of Integrated Circuits and Systems (TCAD) is announcing a special
issue, "Hardware-Oriented Security

NOCS is the premier
event dedicated to
interdisciplinary
research on on-chip,
package-scale, chipto-chip, and datacenter rack-scale
communication
technology,
architecture,
design methods,
applications, and
systems.

and Trust: Threats, Countermeasures
and Design Tools." TCAD invites top
papers accepted to the 2019 Asian
Hardware-Oriented Security and
Trust Symposium (AsianHOST 2019)
and calls for original research papers
through public contributions.
The purpose of this special issue
is to provide targeted readers with
the latest information about advances
and challenges in hardware security
research and development. Topics of
interest include discoveries of emerging security threats encountered by
the hardware design and supply chain,
recent hardware security attacks and

IEEE SOLID-STATE CIRCUITS MAGAZINE

mitigations, and new security protection techniques and design methodologies to thwart these threats. All paper
submissions must be made through
the IEEE TCAD online paper submission
system. Detailed submission instructions can be found at https://ieee-ceda
.org/publication/tcad-publication/tcadpaper-submission.

NOCS 2019-Call for Contributions
The International Symposium on Networks-on-Chip (NOCS) will take place
17-18 October 2019 in New York City at
the same venue as Embedded Systems
Week. NOCS is the premier event dedicated to interdisciplinary research on
on-chip, package-scale, chip-to-chip,
and data-center rack-scale communication technology, architecture,
design methods, applications, and
systems. NOCS brings together scientists and engineers working on NoC
innovations and applications from
interrelated research communities,
including discrete optimization and
algorithms, computer architecture,
networking, circuits and systems,
packaging, embedded systems, and
design automation. Topics of interest
include NoC architecture and implementation, communication analysis,
optimization, verification, novel
NoC technologies, NoC for intelligent
physical systems, NoC at the uncore
and system level, inter/intra-chips,
and rack-scale networks.

http://www.ieee-ceda.org https://ieee-ceda.org/publication/tcad-publication/tcad-paper-submission https://ieee-ceda.org/publication/tcad-publication/tcad-paper-submission

IEEE Solid-States Circuits Magazine - Summer 2019

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