IEEE Solid-States Circuits Magazine - Summer 2022 - 112

24 April 2022 (AoE), so you can watch
the recordings of all live sessions on
demand. Presentations and recordings
can be viewed according to your
bookings for DATE 2022.
DATE 2023 will be chaired by
Ian O'Connor, University of Lyon,
France, and will take place in Antwerp,
Belgium, on 17-19 April 2023.
The short call for papers is available
on the DATE website at https://www.
date-conference.com/date-2023-call
-papers. The deadline to submit is 18
September 2022. If you would like to
stay updated on future DATE conferences,
please subscribe to the DATE
newsletter at https://www.date-con
ference.com/?page=1#block-simple
newssubscription.
2022 Award Nomination Deadlines
The IEEE Council on EDA is soliciting
nominations for its awards. To
view a full detailed listing of each
award, please visit the awards page on
our website at https://ieee-ceda.org/
awards/.
Nomination Deadline: 15 April 2022
The Ernest S. Kuh Early Career Award
recognizes an individual who has
made substantial contributions to
the area of EDA in the early stages of
his or her career.
Nomination Deadline: 30 June 2022
The Phil Kaufman Award for Distinguished
Contributions to EDA
is jointly sponsored by the Electronic
System Design Alliance and
the IEEE Council on EDA. It honors
an individual who has had a
demonstrable impact on the field
of electronic design through contributions
in EDA.
Nominations Are Accepted
on a Rolling Basis
The Distinguished Service Award recognizes
an individual who has provided
outstanding service to the IEEE
Council that has had a significant
benefit to the EDA community.
Call for Participation: MPSoC'22
MPSoC is celebrating its 20th anniversary
on 19-24 June 2022 at the
hotel Les Fermes de Marie, Megève,
France. We will have a special networking
day on Wednesday, 22 June,
where we plan to organize high-level
panel sessions with all of our speakers
from previous years. We have an
exceptional program with 60 worldclass
R&D speakers to cover key
topics for multicore architectures
targeting artificial intelligence and
embedded computing. The experts
discuss fundamental and strategic
issues to master advanced technologies
for software versus hardware
design and semiconductor manufacturing
to build energy-efficient many-core
and many-IP architectures.
More information on the program
and registration can be found at:
http://www.mpsoc-forum.org/.
Call for Participation: International
Symposium on 3D ICs and Heterogeneous
Integration
The Hong Kong University of Science
and Technology will host a virtual
symposium on 26-28 April 2022. The
event features three days of talks by
industry experts and researchers.
Registration is free but required. To
learn more about this event, please
visit the conference website at
https://3dichi.hkust.edu.hk/.
112 SUMMER 2022
IEEE SOLID-STATE CIRCUITS MAGAZINE

https://www.date-conference.com/?page=1#block-simplenewssubscription https://www.date-conference.com/?page=1#block-simplenewssubscription https://www.ieee-ceda.org/awards https://www.ieee-ceda.org/awards https://www.date-conference.com/date-2023-call-papers https://www.date-conference.com/date-2023-call-papers https://www.date-conference.com/date-2023-call-papers https://www.date-conference.com/?page=1#block-simplenewssubscription https://www.ieee-ceda.org/ http://www.mpsoc-forum.org/ https://bit.ly/3w7j3yl http://bit.ly/dtsubmissions https://3dichi.hkust.edu.hk/

IEEE Solid-States Circuits Magazine - Summer 2022

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