IEEE Solid-States Circuits Magazine - Summer 2023 - 114
(a)
(b)
FIGURE 3: (a) and (b) Photos of the event on 23 May 2023.
(a)
(b)
FIGURE 4: (a)-(c) Photos of the event on 25 May 2023.
AP/MTT/SSC Joint Chapter and featured
two presentations. The first
presentation was by Prof. Kwok-Wa
Leung, who is an IEEE Fellow and a
chair professor at the City
University of Hong Kong,
who gave a lecture titled
" Design of Antennas With
Novel Metal Lens. " He covered
the basics of antennas,
established two primary
methods to improve
directionality, and shared
his team's research on
loaded metal lenses
that enhance aperture
efficiency. The second
presentation was by Prof. Nan
Yang, who is the deputy director of the
Guangdong Provincial Key Laboratory
of Optoelectronic Information
These events are
a testament to
the IEEE Tianjin
AP/MTT/SSC
Joint Chapter's
commitment
to promoting
innovation and
excellence in
microelectronics
research.
Processing Chips and Systems and
an associate professor at Sun Yat-sen
University, who gave a lecture titled
" Radiation Pattern Decoupling of
MIMO Antennas. " Yang
elaborated on current
designs for antenna
decoupling, proposed
a method of radiation
pattern decoupling, and
shared his team's focus
on the design of dielectric
resonant antennas and
zero-spacing patch antennas.
In the Q&A session, the
faculty, students, and guests
actively participated, raising
questions on antenna fabrication precision,
metal losses in metal lenses, radar
applications' phase compensation, and
high cross-polarization during testing.
114 SUMMER 2023
These four events demonstrated
the IEEE Tianjin AP/MTT/SSC Joint
Chapter's commitment to advancing
the field of microelectronics and fostering
academic exchange and collaboration
among different institutions
and regions. The events allowed the
participants to broaden their horizons
on the latest advancements in microelectronics
and provided opportunities
for learning and inspiration. As
such, these events are a testament
to the IEEE Tianjin AP/MTT/SSC Joint
Chapter's commitment to promoting
innovation and excellence in microelectronics
research.
-Kaixue Ma
-Yu Luo
-Feng Feng
-Fanyi Meng
(c)
IEEE SOLID-STATE CIRCUITS MAGAZINE
https://orcid.org/0000-0001-8657-2920
https://orcid.org/0000-0002-1298-7880
https://orcid.org/0000-0002-3569-8782
IEEE Solid-States Circuits Magazine - Summer 2023
Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Summer 2023
Contents
IEEE Solid-States Circuits Magazine - Summer 2023 - Cover1
IEEE Solid-States Circuits Magazine - Summer 2023 - Cover2
IEEE Solid-States Circuits Magazine - Summer 2023 - Contents
IEEE Solid-States Circuits Magazine - Summer 2023 - 2
IEEE Solid-States Circuits Magazine - Summer 2023 - 3
IEEE Solid-States Circuits Magazine - Summer 2023 - 4
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IEEE Solid-States Circuits Magazine - Summer 2023 - Cover3
IEEE Solid-States Circuits Magazine - Summer 2023 - Cover4
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