IEEE Solid-States Circuits Magazine - Summer 2023 - 119

CONFERENCE REPORTS
The European Flagship Conferences ESSDERC and
ESSCIRC Merge to Become ESSERC
I
In 1971, the first European SolidState
Device Research Conference
(ESSDERC) conference was organized
in Munich, Germany, aiming to
present the latest developments in
physics, technology, and the characterization
of solid-state devices,
bringing together both the academic
world and industry active
on silicon and compound semiconductor
integrated circuits. ESSDERC
solicits papers in fields such
as advanced devices, process and
integration, telecommunication and
power devices, modeling and simulation,
characterization and reliability,
memory, SoC and SIP, emerging
technologies, and sensors and
actuators. Originally, only short
abstracts were published, and afterward,
selected papers were published
in Revue de Physique Appliqué
(Paris, France). Starting from the
1987 conference in Bologna, Italy,
the short abstracts were no longer
published, but rather, proceedings
with four-page manuscripts became
available to the participants. Due to
an agreement with IEEE, afterward,
all abstracts until 1987, and thereafter,
the proceedings became available
in IEEE Xplore.
In 1975, the initiative was taken
to launch a sister conference, European
Solid-State Circuits Conference
(ESSCIRC), focusing on recent
advances in design concepts, design
methodologies, circuit simulation,
and solid-state circuits. Basic topDigital
Object Identifier 10.1109/MSSC.2023.3283952
Date of current version: 20 August 2023
FIGURE 1: The logo of the first merged conference meeting ESSERC 2024 in Bruges.
IEEE SOLID-STATE CIRCUITS MAGAZINE
SUMMER 2023
119
ics such as analog circuits, digital
circuits, RF and communication
circuits, mixed-signal circuits and
microsystems, and date converters
were addressed. The first conference
took place in Canterbury,
U.K. Also, for
ESSCIRC, all abstracts and
proceedings are available
in IEEE Xplore, while
selected papers are
annually published in
a dedicated edition of
IEEE Journal of SolidState
Circuits (JSSC). This conference
became known as the key circuit
conference in Europe attended by
participants from all over the world.
At their start, both conferences
2023.
were annually organized in different
weeks in September and in
different European cities. Each conference
included keynote, invited,
and contributed papers, selected by
separate Technical Program Committees
but coordinated by a Joint
Steering Committee. Due to the
general need for a stronger interaction
among technologists, device
experts, and circuit designers, in
2002, it was decided to colocate the
The last ESSDERCtwo
conferences and organize them
at the same time and at the same
location. This initiative and the new
format were first worked out by Prof.
Giorgio Baccarani from Bologna
University (ESSDERC
Conference Chair) and
Prof. Rinaldo Castello
ESSCIRC conference
will take place in
Lisbon, Portugal, on
11-14 September
from Pavia University
(ESSCIRC Conference
Chair) for Florence as a
conference location.
There were three joint
keynote presentations. The
delegates had to register for one of
the two conferences, i.e., ESSDERC
or ESSCIRC, to select one of the proceedings
for free but were allowed
and encouraged to attend any of the
parallel sessions. The conferences
were technically sponsored by IEEE,
i.e., by the Electron Devices Society
(EDS) for ESSDERC and the IEEE
Solid-State Circuits Society (SSCS)
for ESSCIRC, respectively. The format,
which is also used for the IEEE
VLSI conferences, turned out to be
very successful, and over the years,
more joint presentations and joint
sessions were organized. Since
2017, both ESSDERC and ESSCIRC
IEEE Solid-States Circuits Magazine - Summer 2023

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