IEEE Solid-States Circuits Magazine - Summer 2023 - 86

implementation of robust carbon
metrics and a design framework that
encompasses the entire life cycle of
cloud computing. By quantifying and
optimizing the embodied carbon
emissions along with the operational
energy consumption, it becomes
possible to make informed decisions
regarding hardware design, energy
efficiency, and the adoption of renewable
energy sources.
In addition to environmental impact,
sustainable practices should
also encompass social and economic
impact. The semiconductor industry
must prioritize employee well-being
by ensuring a safe and healthy
work environment, offering flexible
work arrangements, and supporting
mental health and well-being initiatives.
As the industry continues to
evolve and change over the next 75
years, it is important to note that a
new generation of researchers and
engineers with a heightened awareness
of the impact of their work on
both the environment and society
will emerge. It is essential for the industry
to embrace and support this
new generation.
Overall, the next decades will be a
critical period for the semiconductor
industry to prioritize sustainability
in all aspects of its operations.
Conclusions
The next 75 years of IC technologies
will be characterized by a range of
challenges and opportunities. While
the traditional Moore's law road map
may no longer be valid, the industry
is entering an exciting new phase of
innovation and growth. To succeed
in this environment, designers will
need to be familiar with a range of
different technologies and fields,
from materials science and device
physics to computer science and AI.
They will need to be able to collaborate
effectively with experts from
these fields as well as understand
the various tradeoffs that exist between
different technologies and
design choices. With the right mindset
and skill set, designers can help
86 SUMMER 2023
to shape the future of semiconductor
technologies, creating products
that are not only technically sound
but also socially responsible and environmentally
sustainable.
Acknowledgment
The author would like to thank S. Samavedam,
J. Ryckaert, J. Myers, G.
Hellings, N. Horiguchi, and G. Sankar
Kar for their invaluable insights and
constructive discussions. The author
would also like to express gratitude
to the partner companies that support
the Imec industrial affiliation
programs and to all the diligent researchers
at Imec whose work has contributed
to this article.
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About the Author
Nadine Collaert (collaert@imec.be)
is a program director at Imec, 3001
Heverlee, Belgium. She is currently
responsible for the advanced RF
program looking at heterogeneous
integration of III-V/III-N devices with
advanced CMOS to tackle the challenges
of next-generation mobile communication.
Before that, she was
program director of the LOGIC Beyond
Si program focused on the research
of novel CMOS devices and new material-enabled
device and system approaches
to
increase functionality.
She has been involved in the theory,
design, and technology of FinFET devices,
emerging memories, transducers
for biomedical applications, and
the integration and characterization
of biocompatible materials. She has
a Ph.D. in electrical engineering from
KU Leuven, and she has more than
400 publications and holds more
than 10 patents in the field of device
design and process technology. She is
a Member of IEEE.
IEEE SOLID-STATE CIRCUITS MAGAZINE

http://dx.doi.org/10.1109/MDAT.2016.2544837 http://dx.doi.org/10.1109/MDAT.2016.2544837 https://www.imec-int.com/en/articles/unlocking-system-scaling-bottlenecks-system-technology-co-optimization https://www.imec-int.com/en/articles/unlocking-system-scaling-bottlenecks-system-technology-co-optimization https://www.imec-int.com/en/articles/unlocking-system-scaling-bottlenecks-system-technology-co-optimization https://www.imec-int.com/en/articles/unlocking-system-scaling-bottlenecks-system-technology-co-optimization https://www.embedded.com/integrating-cfet-into-the-logic-technology-roadmap-beyond-1-nm/ https://www.embedded.com/integrating-cfet-into-the-logic-technology-roadmap-beyond-1-nm/ https://www.embedded.com/integrating-cfet-into-the-logic-technology-roadmap-beyond-1-nm/

IEEE Solid-States Circuits Magazine - Summer 2023

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Summer 2023