IEEE Solid-States Circuits Magazine - Winter 2022 - 64

native and postprocessing BER, the
latter of which has recently seen
drastic reductions, thanks to new
techniques mitigating bit instability
for error-correcting code elimination.
With regard to techniques
counteracting side-channel attacks
(EM and power), Figure 22 provides
the progressive improvement in the
measurements-to-disclosure of cryptographic
keys, as determined by the
ratio of the power trace count necessary
for a successful attack in protected
and unprotected designs.
Digital Systems: Digital Circuits
Subcommittee Chair: Keith
Bowman, Qualcomm, Raleigh,
North Carolina, USA
The demand for higher-performance
and energy-efficient platforms ranging
from IoE devices to cloud data
centers and telecommunication infrastructure
continues to drive innovations
in CMOS digital circuit building
blocks, with the goals of improving
performance and energy efficiency
while lowering costs and lessening
design efforts. Variation-tolerant
design continues as a major trend in
digital circuits for robustness across
process, voltage, temperature, and
aging variations in computing architectures
and systems. SoC architectures
present an increasingly closer
interaction between circuits and microarchitectures,
including hardware-driven
clock-gating control.
Digital circuit innovations also enable
new applications leveraging emerging
technologies, such as nonvolatile
memories, thin-film transistors, and
human-body communication.
A continued trend toward application-specific
accelerators is leading
to the development of new circuit
techniques that benefit a range of
emerging applications, such as optimization
problems, AI at the edge,
and massive 5G telecommunications.
Some of these accelerators leverage
approximate computation, resistive
random-access memory (RRAM)/static
RAM (SRAM) compute-in-memory
(CIM) strategies, and adaptive digital
64 WINTER 2022
IEEE SOLID-STATE CIRCUITS MAGAZINE
Graphics
Display
Camera
Image/Video
Audio
Accelerator
Downlink (Mb/s)
CPU (MIPS)
OpenGL
(ES1.1)
OpenGL/VG/MAX
(ES2.0)
VGA
WVGA
at 60 fps
SXGA
at 60 fps
5-8 M 10 M 16 M
H.264/AVC
(VGA)
H.264/AVC
(D1)
AAC AAC Plus
FPU
UMTS
0.4 ~ 2
300
500
SIMD
Multicore (2~4)
HSPA
1.8 ~ 7
500
800
HSPA+
7 ~ 42
800
2,400
20 M
H.264/AVC
(Full HD)
WMA
Dolby 5.1
Multicore
(4~8)
LTE
100
2,400
6,000
6,000
12K
Augmented Reality
WQXGA/WQXGA+
at 60 fps
24 M
H.265/MVC
H.264/SVC
Dolby
TrueHD/Digital+
Heterogenous
Multiprocessing
LTE-A
150 ~ 750
12,000
100,000
LTE-A
1,600
13,000
112,000
WQXGA/WQXGA+
at 60 fpsX2 (VR)
12MxDual
360° VR
H.265/VP9
DSD
Dolby Atmos
Neural Net
Processor
LTE-A
2,000
19,000
162,000
Virtual Reality (VR) Vulkan
WQXGA/WQXGA+
at 120 fps
12MxDual
360° VR
H.265/VP9
HDR
48 M
Tripple
AV1
HDR10+
TWS
Truly Wireless
5 TOPS
5G
5,000
22,000
180,000
2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021
fps: Frames per Second
FIGURE 17: Application-processor trends in smartphones. VGA: video graphics adapter; WVGA: wide VGA; AVC: automatic volume control; SIMD: single instruction, multiple data; UMTS: Universal
Mobile Telecommunications System; MIPS: million instructions per second.
15 TOPS
5G
10,000
26,000
208,000
2022
4,000
240 fps
QHD+
200 M
Quad
8,000
at 30 fps

IEEE Solid-States Circuits Magazine - Winter 2022

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Winter 2022

Contents
IEEE Solid-States Circuits Magazine - Winter 2022 - Cover1
IEEE Solid-States Circuits Magazine - Winter 2022 - Cover2
IEEE Solid-States Circuits Magazine - Winter 2022 - Contents
IEEE Solid-States Circuits Magazine - Winter 2022 - 2
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IEEE Solid-States Circuits Magazine - Winter 2022 - Cover3
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