IEEE Solid-States Circuits Magazine - Winter 2022 - 93

silicon-on-insulator technologies. He
then addressed key reliability challenges
in fully depleted technologies,
such as self-heating, input-output
scaling, middle-of-line reliability,
dielectric-breakdown monitoring,
variation, and stochastic aging. Finally,
Shroff called on chip designers and
manufacturers to collaboratively optimize
chip process technology, design,
and test in an even more cohesive and
transparent partnership.
On 23 July 2021, Samuel Naffziger
from AMD presented a seminar titled
" Architecture and Technology Implications
of a Chiplet-Based Future. "
He pointed out that the chiplet architecture
is now becoming mainstream
and recognized as fundamental in enabling
the continued economically
viable growth of power-efficient computing.
He then discussed the costs
of splitting and modularizing a system
on chip (SoC) into chiplets, which
include the high-bandwidth and lowlatency
communication requirements
between die, the overhead of testing
and power-managing what used to
be individual SoC modules as standalone
chips, and engineering the
package substrate to provide routing
and power delivery resources for
the complex integration. Finally, today's
solutions were evaluated in the
context of what will be required from
packaging and silicon technologies
over the next decade to achieve the
true potential of chiplet architecture.
On 16 August 2021, Debendra Das
Sharma from Intel presented a seminar
titled " Evolution of Load-Store
Interconnects to 64.0 GT/s With
PAM-4 Signaling. " Dr. Das Sharma
discussed the taxonomy of interconnects
and defined the characteristics
of load-store interconnects, such as
PCI Express (PCIe) technology as the
basic building block of a wide variety
of load-store interconnects. He
then delved deep into the PCIe 6.0
specification, which adopts PAM-4
signaling at 64.0 GT/s for maintaining
the same channel reach of prior
generations. Finally, Dr. Das Sharma
presented a new low-power state that
ensures power consumption is proportional
to bandwidth usage without
impacting the traffic flow across
all load-store interconnects.
Please visit the Chapter website
http://ewh.ieee.org/r6/san_diego/
sscs/ for more information including
presentation materials and the Chapter
YouTube channel https://www
.youtube.com/channel/UCKkld1mUbwW
_wolBTTIyadQ for event recordings.
Sign up to receive notifications of
future events.
-Jeff Shi, Mohamed Abouzied,
Albert Chou, Alan Islas-Cital,
and Alvin Loke
IEEE SSCS USTC Student Branch Chapter Activities
T
The IEEE Solid-State Circuits Society
(SSCS) University of Science and
Technology of China (USTC) Student
Branch Chapter worked to educate
and enhance the life of Student Members
by organizing lectures and outdoor
activities in the summer and fall
of 2021. Lecturers visited the Chapter
in person and covered important
topics. These events were an excellent
opportunity for Chapter Members
to connect and network.
On 15 April 2021, the SSCS USTC
Student Branch Chapter organized
a talk by Prof. Hong Zhou, School
of Microelectronics, Xidian University,
Xian, China. The lecture was
held at the West Campus, School
of Microelectronics, with the asDigital
Object Identifier 10.1109/MSSC.2021.3127000
Date of current version: 24 January 2022
sistance of Prof. Shibing Long and
Prof. Haiding Sun.
Dr. Zhou has been engaged in research
on the structure, process, and
mechanism of new semiconductor
power devices, microwave devices,
and logic devices for the past 10
years. He gave a lecture titled " Recent
SSCS USTC Chapter Members and faculty members of the School of Microelectronics with
Prof. Hong Zhou (center).
IEEE SOLID-STATE CIRCUITS MAGAZINE WINTER 2022
93

http://ewh.ieee.org/r6/san_diego/sscs http://ewh.ieee.org/r6/san_diego/sscs https://www.youtube.com/channel/UCKkld1mUbwW_wolBTTIyadQ https://www.youtube.com/channel/UCKkld1mUbwW_wolBTTIyadQ https://www.youtube.com/channel/UCKkld1mUbwW_wolBTTIyadQ

IEEE Solid-States Circuits Magazine - Winter 2022

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Winter 2022