IEEE Solid-States Circuits Magazine - Winter 2023 - 85

A
Dr. Zia Karim Technical Talk on " Low-Temperature Polymides
for Interconnect RDL in Next-Generation 3D Advanced IC
Backend Packaging Application "
" As the Moore's Law has reached
physical limits, the back end of line
is getting more and more research
and industry interests, " commented
Dr. Zia Karim in a technical
talk
held at the Bangladesh University of
Engineering and Technology (BUET)
(Figure 1). The talk, titled " LowTemperature
Polymides for Interconnect
RDL in Next-Generation
3D Advanced IC Backend Packaging
2022. Among the 30 attendees, there
were 10 IEEE Members (Figure 2).
The program started with a brief
In this talk, Dr.
Karim presented
several studies
conducted on the
properties of
different types
of polyamide
materials after
curing under
atmospheric and
vacuum process
parameters.
Application, " was jointly organized
by the IEEE ED/SSCS Joint Chapter,
Bangladesh and the Department of
Electrical and Electronic Engineering
(EEE) BUET on 27 September
Digital Object Identifier 10.1109/MSSC.2022.3218963
Date of current version: 18 January 2023
FIGURE 1: Dr. Zia Karim while delivering the technical talk.
biography of the esteemed speaker,
Dr. Karim, the chief technology officer
of Yield Engineering Systems, Inc.
(YES), Fremont, CA, narrated by Dr.
Md. Zunaid Baten, vice chair of the
ED/SSCS Joint Chapter, Bangladesh. In
this talk, Dr. Karim presented several
studies conducted on the properties
of different types of polyamide materials
after curing under atmospheric
and vacuum process parameters.
This research showed that the
vacuum process resulted in better
thermal stability, properties, and
dielectric strength and a lower dissipation
factor compared to atmospheric
conditions at both conventional
and low temperature. This
would facilitate the fan-out waferlevel
packaging (FOWLP) and fanout
panel-level packaging (FOPLP),
leveraging the improved performance
provided by subatmospheric
curing at low temperature. The talk
was followed by a series of insightful
and perceptive questions from
the audience.
- Bejoy Sikder
FIGURE 2: A group photo of Dr. Zia Karim with the attendees.
IEEE SOLID-STATE CIRCUITS MAGAZINE WINTER 2023
85

IEEE Solid-States Circuits Magazine - Winter 2023

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Winter 2023

Contents
IEEE Solid-States Circuits Magazine - Winter 2023 - Cover1
IEEE Solid-States Circuits Magazine - Winter 2023 - Cover2
IEEE Solid-States Circuits Magazine - Winter 2023 - Contents
IEEE Solid-States Circuits Magazine - Winter 2023 - 2
IEEE Solid-States Circuits Magazine - Winter 2023 - 3
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IEEE Solid-States Circuits Magazine - Winter 2023 - Cover3
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